How can this be true if it is in contact with a heat sink?
		
		
	 
Because depending upon how you count, there are about 7 different components of thermal conductivity to account for before you get to the heatsink fin that actually dissipates all heat to the surrounding air.
1. The silicon itself. All heat generating circuitry is on the bottom and has to travel through something like 1mm of silicon. Thermal conductivity of silicon is 149 W/m*K, aka it'd take 149kW of thermal energy to cause a 1C temperature difference across 1mm. So it's a quite trivial value in terms of temperature increase for the thermal power we're talking about. However, it still needs to be taken into account because of the fact that it's the first place where localized power output is spread to a larger area (why a single-threaded load attached to a particular core causes temperature rise in the others.)
2. Silicon -> IHS interface. Thermal conductivity for thermal grease ranges from 0.5 W/m*K for cheapo stuff up to around 9 W/m*K for something like AS5. (The Maingear Epic T100 TIM advertises 20 W/m*K.) Who knows what exactly Intel uses, but I doubt it's on either extreme given that this is by far the most important thermal interface due to the small size. If you go with a 0.025mm thermal gap (no idea whether it'd be larger or smaller than this) and a 2.5 W/m*K thermal compound, on a 160 mm^2 IVB die you'd end up with 15 W/K, aka at 150 watts you'd see a 10C temperature rise across this interface. (Yes, it's a simplistic way of calculating it, but gets the point across. Also, my guess is that an issue with this interface in that particular ES could be the cause for the abnormally high temperatures reported.)
3. IHS. Same as silicon, but copper is at 409 W/m*K, so again its a minimal effect upon temperature rise while having a far greater effect upon increasing the effective surface area for the next thermal interface. If you wanted to, you could then include the mechanics of the zinc coating on top of the copper.
4. IHS -> Heatsink interface. Same as the silicon -> IHS, and most likely the greater surface area would offset the increased gap distance. So again a 10C temperature rise could be expected.
5+ Once to the heatsink doesn't mean that there aren't further sources of resistance. As direct heatpipe contact designs have shown, there's thermal resistance to be found in something so simple as heatpipes running through a copper block that has the initial contact to the heat source.