You would have to make a little platform, somewhere around the size of the CPU die, and affix sandpaper to it. It would be exactly the height off the surrounding table that the height of the inside of the IHS is. As you removed material, you would have to make it higher. Perhaps spring-load it.
Maybe take pane of glass, cut a hole in it, and spring-load a tiny block that has sandpaper on it from down below?
Hey what about sanding down the base of the lid a bit to reduce/eliminate the "gap" between it and the core of the CPU?
Did you disable the onboard video? I know other members have had issues that seemed to be fixed by it. Might just be a temp thing that will be fixed with a later bios rev.
How is this coming?
If you sand the base of the IHS to get the under side of the IHS closer to the CPU die, will that lessen the clamping force of the CPU retension? Being new to Socket 1155, I didn't realize that the CPU socket retention mechanism clamps down on the IHS.
It clamps on the sides of the IHS. Parts that you aren't touching when you sand it.
You see in the following picture two tabs on either side that poke out just a bit on the IHS and the retention bracket clamps down on?
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If you sand the bottom of the heatspreader you are decreasing the pressure the tabs will apply....But were most likely talking 1000ths of an inch so I doubt it would effect it.
How so? Don't get me wrong I'm not trying to argue your point but like...if you sand the inside and the top of the IHS is now closer to the core and thus your HSF is clamping onto something closer to the core (should be good right?), how does that affect the claimping pressure of the entire CPU in the bracket? From what I understand the IHS touches the CPU around the die so it's not just clamping right down on the die only. Does that make sense? What I mean is you're clamping the whole thing (green board and all) right down onto the pins so you're not really changing anything in that regard from my view of it.
Lol...well said Confucius, and so true.the things a man can accomplish when he's not spending his time on women
brings a tear to the eye.
If you think about what you stated you would realize that if you just sanded the inside top of the heatspreader the gap between it and the core would increase. If a person wanted to decrease the gap they would have to sand the base of the heatspreader. If you sand the base the tabs on the side would get thinner decreasing the pressure possibly. Most likely were talking very little material sanded off so I doubt it would make much differance on clamping pressure.
Well I think I'm done attempting to figure out the hardware incompatibility here and am just going to move on with attempting to do the tests.
After RMA'ing my MIVEZ mobo, my 3770k, and trying three different video cards, I have narrowed down the problem.
Only when I am using my 3770k, and only when I plug the video card into the native x16 PCIE slot, and only when windows is loaded and the video drivers are initialized, the screen is put to sleep and refuses to wake up until I reboot the system.
This issue doesn't happen with the 2600k plugged into the same system, and it doesn't happen if I put the video cards into any PCIE slot so long as it is not in slot 1 (unless I am using my 2600k, then the vid cards can go in slot 1 without a hitch).
/pullshairout
Let the games begin
Video issue was with both nvidia and amd cards?
3 Nvidia cards. I have AMD cards in my other computers, but I did not pull them to see if the problem continued. Given the fact that the problem only exists when I plug an IB CPU into the system, and it doesn't appear when I plug my SB CPU into the exact same system, tells me something is borked with either the BIOS or the OS chipset drivers.
This 3770k is amazing. My MIVEZ only allows the Vcc to go down to 0.8V (the BIOS does not allow it to be set any lower).
With my 2600k, it was LINX stable with 0.8V up to 1.8GHz. (with a NH-D14, and lapped)
But this 3770k is LINX stable with 0.8V all the way up to 3.1GHz with the stock cooler and stock TIM.
Cool. What kinda temps you get at such low voltage and speed?
I'm thinking it'll take some heat to get the stock TIM under the heatspreader to set in good. Might wanna crank her up for a little bit to make sure it's set before you get too far into data collection phase for temps, etc.
At 3.1GHz and 0.801V (measured), I get 61C on my hottest core with an ambient of 25.1C.
At 3.9GHz and 1.098V (stock), I hit TJmax at 105C and start to throttle (and that was even with a slightly cooler ambient of 24.2C).
If the TIM under the IHS is going to reflow, it has already had its opportunity(I ran it at 105C and 3.9GHz for probably 3hrs)
Oh this is neat, I realized I was going about the low-voltage angle all wrong. Switched to using offset mode, my 3770k is currently purring along at 1.6GHz on LinX sipping a mere 0.632 V
(temps are still hitting 47C though D![]()
Still using the stock cooler? Seems kinda high for such a low clock and vcore....But the stock cooler does suck!
Yes and yes.
Ok folks, I finally got my IB 3770k set up and functioning. . . . . . . . .
So you milking this experiment for all she's worth? Just wondering as no updates![]()
