During my thermal compound testing, I ran the new Radio Shack compound and it just flat sucks. It half-way dried out in 6 hours. It also made me lower my overclock from 1400 (which every other compound I tested was stable at) to 1370, just to be able to run the tests (which lowering the speed actually invalidated the comparison data, but I didn't care as I didn't even finish the test because my system was behaving poorly). Anyway, after I removed the waterblock I noticed the base (silicone most likely) had destabilized from gel to liquid and ran down the waterblock.
Older Radio Shack paste was probably just a standard zinc oxide thermal compound, but the new stuff is not acceptable for AMD use IMHO. It is pure crap.