While I use a different board (EVGA 680i), the issue discussed in this thread is one of the main reasons I went with blow-down HSF with my Q6600. (Scythe Andy) AnandTech HSF reviews still 'downplay' the blow-down type of heat sinks because they don't net you as high overclocks (80% CPU load at that :roll: ) as the L-shaped ones do. But the true value of the heat sinks like Andy Samurai is that it moves air around CPU socket area. (NB/memory/MOSFET) And often times these components get very hot without users' knowledge.
This doesn't mean that L-shaped HSF are inferior. They are indeed superior than blow-down type heat sinks in CPU cooling itself. But when using these popular L-shaped HSFs, often times the NB, memory, or VRMs don't get any air-flow at all. From my experiences, the 'death ratio' of mobo/memory was much higher with L-shaped HSFs. This is before I learned how hot things get around CPU socket and now I always make sure to have air-flow there, or go with a blow-down HSF.