^ ^ ^ ^ ^
Other than that, the wccf article states "Nikkei's sources also believe that the overall chip volume TSMC has dedicated to Intel is higher than that dedicated to Apple, resulting in the smartphone maker delaying adopting the 3nm process for its next year's smartphone upgrade." - which sounds really counter-intuitive for me.
TSMC has been consistently saying N3 would ship in volume in "H2 2022". If it comes too late to be used in the fall 2022 iPhones, Apple might not use it in a product until the iPad Pro the following spring. They would never delay an iPhone launch to get a slightly better SoC. Maybe there would be some N3 Macs in that six month span as well, but Apple's real wafer volume begins and ends with iPhone, so no iPhones on N3 (or possibly N3P by that time?) until fall 2023 means TSMC would end up with a lot more unclaimed initial N3 wafers than was the case with N5.
I'm still not 100% sold on that TSMC would allow their process cadence to slip out of step with that of their biggest and most important customer, but the claim in that article does fit with an "H2 2022" that comes too late for Apple to use in next year's iPhone. Sometimes reality doesn't work out the way you plan, and if TSMC found they would be unable to ship N3 wafers in time to meet Apple's schedule, both companies would need to adjust their plans to that new reality. If so, that became Intel's good luck.
As for why Intel is getting those wafers and not AMD, I assume Intel was waving around wads of cash willing to prepay two or three years in advance for early access to N3 wafers and AMD was not. They probably assumed they'd get access to N3 after Apple's allocations, but if the schedule didn't allow Apple to grab all the initial N3 production like they did with N5 then Intel got a better deal than they planned. Despite AMD's recent success, they don't have the huge piles of cash on hand required for buying wafers years in advance of the process even existing like Intel and Apple.