Intel: 'EUV Facts Don't Add Up' for 22 nm in 2011
David Lammers, News Editor -- Semiconductor International, 4/22/2008 8:38:00 AM
Intel Corp. (Santa Clara, Calif.) has decided that extreme ultraviolet (EUV) lithography will not be production-worthy by 2011 when Intel plans to begin manufacturing 22 nm microprocessors, said Mark Bohr, director of process architecture and integration at Intel's logic technology development group (Hillsboro, Ore.).
?The facts don?t add up for EUV. Fact one is that Intel plans to do 22 nm in 2011. Fact two is that I don?t think anybody will claim that EUV will be ready for volume production that year. Maybe a year later, in 2012. I hope so, and Intel certainly will be pushing for that. However, we won?t delay our 22 nm technology to wait for it,? Bohr said.
http://www.semiconductor.net/a...A6553758.html?nid=3572
So EUV isn't necessary for 32nm or 22nm...provided you have immersion litho and some aggressive mask optimization protocols. Good news for just about everyone who was intending on going to 22nm (IBM, AMD, etc) but who likely weren't going to be capable of affording $180M for an EUV tool (IBM, AMD, etc).
Also two nice tidbits were dropped at the end of the story:
?We are on schedule to ramp 32 nm MPU products in the second half of 2009,? Bohr said. The 22 nm ramp will come in 2011, although challenges remain.
(OK, that one isn't much news, but confirms the schedule at least...Westmere likely coming in Q4/09)
And:
Asked whether Intel will be able to extend planar transistors to the 22 nm node, Bohr said, ?Whether it is planar or vertical, these are the kinds of questions we are asking ourselves. There are a couple of paths, including planar, that look like they can work at 22 nm.
Understand that planar transistors wouldn't even be an option to contemplate at 22nm node unless 32nm was guaranteed to be planar transistors. So that pretty much kills the earlier speculation (Nemesis) that 32nm will be anything more spectacular than a standard shrink (meaning no new materials or fancy 2D->3D changes) for the front-end...and quite possibly it will be extended to 22nm node as well.
Making the 16nm node the earliest timeframe for introducing 3D transistors as well as EUV. All continues to be good news for the competition as it continues to suggest the future technology roadmaps are not going to require Intel sized R&D budgets to make the next two nodes at least.