Dufus
Senior member
- Sep 20, 2010
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That's a possibility. What can be done about it, lower the TDP and lose the gains in frequency improvement so it ends up being about the same frequency as previous lithography but at lower power. Or keep around the same package power by using more integration into the CPU and / or more cores.Very likely 14nm high performance is suffering from heat density problems (which is not a process problem) and intel needs some more refinement. That doesn't mean that its impossible or a failure.
Tjc thermal resistance seems to be getting higher as we get smaller dies. Perhaps a rough idea can be made from the temperature differential between working and idle cores or all cores and an idle integrated graphics temperature.
Since Intel have already posted in the ark a couple of BDW Xeon's I would think they would be out this month. Interesting both are spec'd 45W TDP while one is 4C/8T and the other 8C/16T with a Tcase spec of 80C. Both turbo to 2.6GHz with 2.2GHz and 2GHz HFM respectively. So something like 20% less core power for 8 vs 4 at the HFM which seems a bit odd.
