2020, Intel 10nm SuperFin (10SF): Current generation technology in use with Tiger Lake and Intel’s Xe-LP discrete graphics solutions (SG1, DG1). The name stays the same.
2021 H2, Intel 7: Previously known as 10nm Enhanced Super Fin or 10ESF. Alder Lake and Sapphire Rapids will now be known as Intel 7nm products, showcasing a 10-15% performance per watt gain over 10SF due to transistor optimizations. Alder Lake is currently in volume production. Intel’s Xe-HP will now be known as an Intel 7 product.
2022 H2, Intel 4: Previously known as Intel 7nm. Intel earlier this year stated that its Meteor Lake processor will use a compute tile based on this process node technology, and the silicon is now back in the lab being tested. Intel expects a 20% performance per watt gain over the previous generation, and the technology uses more EUV, mostly in the BEOL. Intel’s next Xeon Scalable product, Granite Rapids, will also use a compute tile based on Intel 4.
2023 H2, Intel 3: Previously known as Intel 7+. Increased use of EUV and new high density libraries. This is where Intel’s strategy becomes more modular – Intel 3 will share some features of Intel 4, but enough will be new enough to describe this a new full node, in particular new high performance libraries. Nonetheless, a fast follow on is expected. Another step up in EUV use, Intel expects a manufacturing ramp in the second half of 2023 with an 18% performance per watt gain over Intel 4.
2024, Intel 20A: Previously known as Intel 5nm. Moving to double digit naming, with the A standing for Ångström, or 10A is equal to 1nm. Few details, but this is where Intel will move from FinFETs to its version of Gate-All-Around (GAA) transistors called RibbonFETs. Also Intel will debut a new PowerVia technology, described below.
2025, Intel 18A: Not listed on the diagram above, but Intel is expecting to have an 18A process in 2025. 18A will be using ASML’s latest EUV machines, known as High-NA machines, which are capable of more accurate photolithography. Intel has stated to us that it is ASML’s lead partner when it comes to High-NA, and is set to receive the first production model of a High-NA machine. ASML recently announced High-NA was being delayed- when asked if this was an issue, Intel said no, as the timelines for High-NA and 18A are where Intel expects to intersect and have unquestioned leadership.