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Intel Broadwell Thread

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Xeon E5 v4 'Broadwell-EP' Processor Family Officially Launched - Part 2

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www.nextplatform.com/2016/03/31/broadwell-brings-xeon-e5s-balanced-performance-bump
 
AnandTech's review is out:

AnandTech - The Intel Xeon E5 v4 Review: Testing Broadwell-EP With Demanding Server Workloads

The fact that only 22 of those 24 cores are activated in the top Xeon E5 SKU is purely a product differentiation decision. The 18 core Xeon E5 v3 used exactly the same die as the Xeon E7, and this has not changed in the new "Broadwell" generation.

The largest die (+/- 454 mm²), highest core (HCC) count SKUs still work with a two ring configuration connected by two bridges. The rings move data in opposite directions (clockwise/counter-clockwise) in order to reduce latency by allowing data to take the shortest path to the destination.

...Just like Haswell-EP, the Broadwell-EP Xeon E5 has three different die configurations. The second configuration supports 12 to 15 cores and is a smaller version (306mm²) of the third die configuration that we described above. These dies still have two memory controllers.

24-core die size: 454mm²
15-core die size: 306mm²

On Haswell, one AVX instruction on one core forced all cores on the same socket to slow down their clockspeed by around 2 to 4 speed bins (-200,-400 MHz) for at least 1 ms, as AVX has a higher power requirement that reduces how much a CPU can turbo. On Broadwell, only the cores that run AVX code will be reducing their clockspeed, allowing the other cores to run at higher speeds.

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www.anandtech.com/print/10158/the-intel-xeon-e5-v4-review
 
I'm actually kind of shocked that a single 22C Broadwell-EP is only slightly behind a dual Ivy Bridge-EP set-up with 24 physical cores and much higher clockspeeds.
 
BTW the die size for the 10-core parts that should power Broadwell-E (Core i7-69xx) is ~246mm². 22nm Haswell-E packs 8 cores at 356mm².

Here's Cinebench R15 with a 2S Xeon E5-2699 v4 system:

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And benchmark results from ServerTheHome:

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www.servethehome.com/intel-xeon-e5-2699-v4-benchmarking-the-top-end

If you missed last page:

Xeon E5 v4 'Broadwell-EP' Processor Family Officially Launched

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Three die configurations: 10-core (up to 8 active), 15-core (up to 14 active) and 24-core (up to 22 active)

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More here

Supermicro New Generation Servers with Intel Xeon E5 2600 V4 (Broadwell) Product Family Support

SPECjbb2015 Results for Xeon E5-2699 v4

Amazon listing

MSI's X99S XPOWER AC LGA2011-v3 motherboard gets official support after BIOS update

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www.nextplatform.com/2016/03/31/broadwell-brings-xeon-e5s-balanced-performance-bump
 
You can just feel the disdain for Intel's server product superiority ooze from this reviewer.
Not to mention those regular senteces ending with".."

I don't think Intel has many problems. I see from what I can tell a pretty nice set of improvements / new features, more cores, new production process. Intel always said they promise 20% per gen, which they pretty much deliver.

And never mind Skylake that's coming next year..
 
One die is smaller than Tahiti or Tonga, the other is no bigger than Hawaii. That demonstrates just how badly we're getting soaked on pricing, due to the lack of competition.

Cost/mm^2 here is much higher, your comparison doesn't make a ton of sense. Also can guarantee you that the R&D intensity of developing a high performance server processor is much greater than that of developing a dGPU.
 
One die is smaller than Tahiti or Tonga, the other is no bigger than Hawaii. That demonstrates just how badly we're getting soaked on pricing, due to the lack of competition.

Yes and NAND is even cheaper. OMG Evil Nvidia and AMD!

Just shows how little you know about cost and business. Specially R&D.
 
I wonder if we will see a full 15-core SKU based on the MCC die with Xeon E5-4600 v4 (or maybe even Xeon E7 v4).
With a 14 core SKU, Intel can turn off the leakiest or slowest core of the die.
 
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Not to mention those regular senteces ending with".."

I don't think Intel has many problems. I see from what I can tell a pretty nice set of improvements / new features, more cores, new production process. Intel always said they promise 20% per gen, which they pretty much deliver.

And never mind Skylake that's coming next year..

Intel is claiming that too. But I dont see it. The ipc gain is only about 5% and little or no gain in clockspeed. The only way they get significant gains is with more cores.

Makes me wonder if BW-E will improve at all over HW-E.
 
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