Intel 65nm Chips Lack Balls!

[TrevorRC]

http://www.chipworks.com/news/2006_65nmLackBalls.asp

I found it interesting.

"Copper Pillar Bumping in flip-chip assembly offers higher connection density, better electrical and heat-dissipating performance, greater mechanical strength and potentially increased reliability."
Wonder what this means for overclocking?

 

[phr0m]

hmmmmmmm looks like theys can be pushed to the limits and be able to last for awhile longer at them

 

[stardrek]

Crap, I double posted...how do I delete a topic made in the forum?

 

[TrevorRC]

PM a mod, or something like that. And yeah, it'll be interesting to see what kind of suicide shots come from these