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Integrated Heat Spreader

The integrated heat spreader will be used on the "new" .013 wafer thin
P-3's. Intel will discontinue the current P-3's late this year.
 
No, because FC-pga chip construction is different than ppga chip construction. On PPGA chips, the CPu is on the "backside" section of the PCB. On Flip-Chips, it is on the oppposite side, above the PCB.


Mike
 
Which makes it better for cooling.

Isn't the integrated heat spreader on the pIV? If they're engineered pretty well and are in firm contact with the die. I would assume problems with cracking or chipping off the edges of a chip would be gone, another plus.

BTW- does anyone know what the heat spreaders on intel are made of? I assume Aluminum. Any plans for copper?
 
Hey Imperium97,

The p4 one is out of aluminum, and I don't think anyone's cracked their p4 core yet. Even though not too many "enthusiasts" use them.


Mike
 
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