Integrated Heat Spreader

[Demon-Xanth]

Isn't that simply going from FCPGA to PGA with a metal cap (like the K6-2!)

 

[ROJAS]

The integrated heat spreader will be used on the "new" .013 wafer thin
P-3's. Intel will discontinue the current P-3's late this year.

 

[Mikewarrior2]

No, because FC-pga chip construction is different than ppga chip construction. On PPGA chips, the CPu is on the "backside" section of the PCB. On Flip-Chips, it is on the oppposite side, above the PCB.


Mike

 

[Imperium97]

Which makes it better for cooling.

Isn't the integrated heat spreader on the pIV? If they're engineered pretty well and are in firm contact with the die. I would assume problems with cracking or chipping off the edges of a chip would be gone, another plus.

BTW- does anyone know what the heat spreaders on intel are made of? I assume Aluminum. Any plans for copper?

 

[Mikewarrior2]

Hey Imperium97,

The p4 one is out of aluminum, and I don't think anyone's cracked their p4 core yet. Even though not too many "enthusiasts" use them.


Mike