I managed to get my mobo temps down a bit by adding a fan across from the southbridge, but my CPU is still in the low to mid 40C on idle. I have a new AMD Quad pipe heatsink/fan for my non-OCed Opteron 170 on a A8N32 mobo. As some (all) of your know, I reapplied thermal paste (as5) and added an old sound card to my system, resetted the heatsink, and my temps went from mid 30Cs to mid 40Cs. Many of you said could be improper heatsink installation. I checked and it is very snug, both clips are in place, and the pull back lock machanism is locked under its holding clip. It moves very little. I don't see signs of blockage in the fan area . Could I have damaged the heatsink somehow? What should I be looking for in terms of placement and damage. Thanks.
Improper Heatsink Installation?
- Thread starter jack bauer
- Start date
what temps do u expect? its fukin summer at least where i live and @topic maybe ur case ventilation is just not the best. besides temps around 40-45° are nothing to worry about. and having 30° instead of 40° - u really think that matters? ur cpu wont live longer or work faster anyways...
Usually temps will go up a little because too much thermal compound was applied. It also could be that the originally smooth HSF bottom got nicked by setting it down on something. The temps you cite are not alarming, but you should be able to get back to where you started.
Jack,
Would agree with Newf that it sounds like too much paste.
The simple principle of thermal paste (AS5 or any other) is that getting direct contact bewteen the CPU and your copper heatsink would require mirror like machining to a level that isn't practical.
Therefore when you place the two together you end up with tiny airgaps between the two surfaces and air does not conduct the heat very well, so we use a thermal conductive paste (AS5 being one of the better ones) to fill these tiny airgaps, as the thermal paste conducts heat better than air.
The problem is that thermal pastes (AS5 included) don't conduct nearly as well as direct contact with your copper heatsink, so in theory you need to apply a VERY thin layer that when the heatsink is mounted, gives a uniform contact surface with no air gaps.
This of course is the theory, as making that thin a layer and not disturbing it when attaching the heatsink is not practical, but too much paste will definitely reduce the effectiveness of your heat transfer.
I have found recently that the best way to apply a thin layer of AS5 is:
a) Warm it up in a warm water bath (about 30-40C) this makes the paste less viscous and easier to spread.
b) Apply to the CPU outside the MB using the foam transit pad to seat it on, and I warm the CPU with hot-air stripper/hairdryer so not cold!
c) Apply 1/2 BB spot of paste and I use a fresh/new razor blade to spread as evenly and thinly as practical (you should be able to read the AMD logo/description through the paste)
d) Carefully refit pre-pasted CPU not touching the top surface, which is much easier now with zero force CPU clamps.
e) Carefully fit CPU Heatsink/cooler trying not to disturb the paste too much.
Some report burn-in times for AS5 of 100+hrs, but personally I see little difference now even after months, so you should see temps back at least at your lower ones straight away.
Ridesy
Would agree with Newf that it sounds like too much paste.
The simple principle of thermal paste (AS5 or any other) is that getting direct contact bewteen the CPU and your copper heatsink would require mirror like machining to a level that isn't practical.
Therefore when you place the two together you end up with tiny airgaps between the two surfaces and air does not conduct the heat very well, so we use a thermal conductive paste (AS5 being one of the better ones) to fill these tiny airgaps, as the thermal paste conducts heat better than air.
The problem is that thermal pastes (AS5 included) don't conduct nearly as well as direct contact with your copper heatsink, so in theory you need to apply a VERY thin layer that when the heatsink is mounted, gives a uniform contact surface with no air gaps.
This of course is the theory, as making that thin a layer and not disturbing it when attaching the heatsink is not practical, but too much paste will definitely reduce the effectiveness of your heat transfer.
I have found recently that the best way to apply a thin layer of AS5 is:
a) Warm it up in a warm water bath (about 30-40C) this makes the paste less viscous and easier to spread.
b) Apply to the CPU outside the MB using the foam transit pad to seat it on, and I warm the CPU with hot-air stripper/hairdryer so not cold!
c) Apply 1/2 BB spot of paste and I use a fresh/new razor blade to spread as evenly and thinly as practical (you should be able to read the AMD logo/description through the paste)
d) Carefully refit pre-pasted CPU not touching the top surface, which is much easier now with zero force CPU clamps.
e) Carefully fit CPU Heatsink/cooler trying not to disturb the paste too much.
Some report burn-in times for AS5 of 100+hrs, but personally I see little difference now even after months, so you should see temps back at least at your lower ones straight away.
Ridesy
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