Folks, I've been away awhile. I remember the generally accepted way of applying thermal paste was to apply a pea or lentil size blob and use a credit card to "squeegee" it down to the correct thickness on the CPU. Recently I've seen posts that state "just put a rice kernel size blob in the center of the CPU and just crank down the HSF unit - it'll spread everything out okay. What's the current generally accepted practice? I remember ever so carefully spreading Arctic Silver on Athlons, and just want to see what is safe with todays CPUs, - AMD and Intel. Thanks folks.