I agree to an extent, I am just having difficulty seeing how they can't have a parallel product stack under a different brand or even literally stick it in the gaps lower down the product stack. PCs aren't really one size fits all and even having parallel products under the same brand can work. Then again I'm no psych or business major so maybe that isn't feasible.OEMS absolutely do want to carry AMD laptops, but they are faced with the challenge of making AMD laptops that fit somewhere in their product lineup.
Doesn't Google offer hardware design macros for a hardware vp9 codec?If they want to be competitive in power efficiency, they´ll implement VP9 in their UVD. Youtube uses VP9 for their HTML5 player and it is otherwise ramping up pretty quickly since it is completely free.
Unless you have actually tried a laptop which produces > 42W of heat, it is actually pretty hard to imagine how much noise and heat that actually is. On desktop standards that amount is basically nothing, but on a laptop it is something which I cannot personally accept.
As an example of different cooling gear for different TDPs I thought these teardowns of the 13.3" and 15" Apple Mac Pro Retina (late 2013) models were interesting:
https://www.ifixit.com/Teardown/MacBook+Pro+13-Inch+Retina+Display+Late+2013+Teardown/18695
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https://www.ifixit.com/Teardown/MacBook+Pro+15-Inch+Retina+Display+Late+2013+Teardown/18696
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The first laptop is the 13.3" model with a 28W Haswell dual core.
The second laptop is the 15" model with a 47W Haswell quad core with Iris Pro graphics.
Copper heatsink size is about the same for both, but the 47W model uses two fans (each with blowing air into a very small aluminum finned area). This compared to the 28W model which only uses one fan, but notice the aluminum finned area is much larger.
So overall, I would say both 28W and 47W set-ups have the following amount of material:
Copper heatsink material: About the same for both the 47W and 28W
heatpipe: twice as much for the 47W
fans: twice as much for the 47W
aluminum finned material (this is the part next to the fan): About the ~same total weight for both, the 47W has less of it for each fan.
So it appears the amount of metal used for cooling isn't really that different between the two TDPS, but difference in ventilation is much in favor of the 47W.
a thin 15W chassis can't support a 35W turbo.
Does AMD need to worry about is how upset OEMs are over the gimping of their processors?
Considering how Intel bribed OEMs to blackball AMD in the past it seems like it would be foolish to give OEMs any opportunity to hamper performance since they could have an agreement with Intel to produce AMD products but only in gimped form.
Eliminate DDR3 being used with discreet GPUs.
I'm not sure how representative the following list is, but you'll notice that all quad core Carrizos have dGPU (designated DX, for dual graphics). The only APUs without dGPU are the dual cores.
In these situations I believe the single channel is fine for a 15W quad core with dGPU (but maybe not for the dual core with 256sp iGPU).
With that mentioned, one question is can a 35W quad core DDR4 APU with dual channel (2 x 4GB) DDR4 replace any of those 15W Quad core DDR3 APU with single channel (1 x 8GB) APU + dGPU?
Pretty sure he wouldn't do that. The 1st "fix" consists in removing any dGPU OEMs insist to add to the mix and using the extra TDP room for a proper cTDP implementation (15W while on battery, 20-35W TDP while plugged in). 2nd (optional) fix is to remove the optical disk drive and use the savings to ensure a decent battery and a somewhat slimmer unit.
Platform cost goes down, and from a marketing standpoint all they need to do is show the damn thing plays League or other MOBAs.
I believe Apple is using the thermal capacitance of their chassic much more effectively than the other manufacturers. The usual cheese grade laptops don´t have a alloy chassis either.
AMD STAPM (Mullins, Carrizo) relies on thermal capacitance too.
I don't. Carrizo in 15w mode is restricted to DDR3-1600. Single-channel DDR3-1600 provides less bandwidth than many DDR2 dual-channel configs, such as the one on my x2-3600+ which I overclocked to a whopping 3.2 GHz!!! Wow! So fast.
I don't think AMD should have allowed Carrizo to pair with dGPUs at all, period. Intel pretty much owns the CPU + dGPU laptop market, and it would be very difficult for AMD to break into that with Carrizo.
The whole value proposition of Carrizo is to lean on the iGPU so that the OEM doesn't have to worry about the cost of including the dGPU, the cost of cooling the dGPU, or the cost of providing power for the dGPU, while still retaining respectable performance.
P.S. How large is the AMD Carrizo reference laptop you were (or are) using? Is it plastic or aluminum?
I think it is a 15.4" chassis. The chassis is basically completely made out of plastic. The whole system is bending while you are prying the lid open. One of the worst quality chassis and displays I´ve ever seen. Probably the only parts made out of metal are the hinges. I dunno what´s wrong with the display since it is a AUO IPS LED panel, but I´ve never seen as much backlight leakage on any panel in the past.
It is a barebone system after all.
When you use it at 35W, rather than 42W AC boost does it quiet down noticeably?
There is no difference. The fan is controlled by the APU power management directly. Fully tied to the die temperature.
If cTDP is set to 35W, the boost power limit will always be 42W. It is possible to be configured separately for AC/DC, however at default such configuration is not used.
Anything beyond the stock 15/25W configuration is too hot, too loud and drains the battery too quickly for my taste![]()
Heat is a problem but there are thin laptops with dgpus that run just fine, look at the macbooks etc. I dont see where a little engineering can't solve some of its rough edges.
Heat is a problem but there are thin laptops with dgpus that run just fine, look at the macbooks etc. I dont see where a little engineering can't solve some of its rough edges.
That 47W MacBook has two decent sized fans. I'll bet this makes heavy workloads simultaneously stressing both the CPU and GPU fairly quiet though. This at the expense of some battery size.
However, with external dGPUs becoming available (via usb-c or Thunderbolt III) I do wonder how important having two fans (or even a large iGPU) is if the average laptop is only getting heavy usage while on AC power. (re: having a dGPU outside of the laptop means only CPU part should be stressed potentially reducing noise if max turbo is controlled).
This brings up at least the following question (for a Hypothetical 35W Bristol Ridge laptop):
How should fan and battery size be balanced for any given size laptop PCB?
1.) Should the fan or fans be large at the expense of room for battery
2.) Should the battery be larger at the expense of room for fan(s) or fan size.
I would hope #2 could work. Then the laptop has a niche of relatively "long" gaming run time while on battery.
Then if #2 works, what is the best way of doing the cooling with the least amount of area spent? Two smaller fans side by side in front of a single heatsink vs. one larger fan in front of a single heatsink? Which yields a better cooling effect per volume?
When you use it at 35W, rather than 42W AC boost does it quiet down noticeably?
There is no difference. The fan is controlled by the APU power management directly. Fully tied to the die temperature.
If cTDP is set to 35W, the boost power limit will always be 42W. It is possible to be configured separately for AC/DC, however at default such configuration is not used.
So configuring separately for AC power would mean limiting to 35W while on battery? And then only getting the 42W when plugged in.
If that is true, then I would think AMD could allow any degree of TDP split to happen if they wanted to? For example: 15W while on battery and 35W or 42W while on AC power.
With that in mind, for a 35W or 42W laptop does the VRM implementation take up much more room than a 15W VRM implementation? (I'm trying to imagine a relatively small laptop that normally runs on 15W, but would be capable of 35W or 42W when on AC power.....and thus I am wondering if the extra VRMs would have a significant negative effect on laptop PCB size and thus maximum battery size)
To maximise the performance on AC and to maximise the battery life while on DC you could do following configuration:
TDP Limit = 35W
PPT Limit AC = 42W
PPT Limit DC = 20W
STAPM = Enabled
STAPM Duration = 200 seconds
STAPM Scalar = 100%
BBT = Enabled
BBT Scalar = 50% (of TDP) // 17.5W
You would have the maximum officially supported cTDP configuration (35W TDP, 42W PPT) available when plugged in to AC and 17.5W power limit enforced while on battery power.
The main issue is the cooling of the VRM. The dissipation of the VRM directly correlates with the power drawn by the load (APU). The additional phases added to the VRM will do no good, unless the dissipated heat can be removed. As the cooling in laptops in general, cooling the VRM on a laptop effectively is extremely hard (and expensive).
Both the AMD reference Carrizo system and Lenovo Y700 throttle due VRM overheating after ~ 10 minutes of proper CPU or GPU intensive use, eventhou both of them were designed to handle 35W TDP APUs. When both of the main circuits are stressed together it shouldn´t happen as easily. That´s because the power limit will be shared between the two and the power in each circuit will be effectively cut in ~ half.
So that would be another way to make a 35W laptop run cooler.
However, with this pointed out, I still like the idea of replacing the laptop's battery with a casing having two or more thin fans injecting air (coupled to a CPU heatsink with perhaps a bit more surface area on the finned area) better.