hmm, intel chips sure are sturdy!!

[Smoove910]

Jeez! I guess I'm a stickler for cleanliness!!!

 

[hokies83]

Jeez! I guess I'm a stickler for cleanliness!!!

Me to.. but i smoke so tar gets in there and dust sticks to it heh.. every month i gotta wipe everything down with distilled water.

 

[tommo123]

it was running 24/7 for around 5 years i think so not surprised it's so dusty. the mobo isn't that bad actually.

IDC - the paste is solid but chipping away. like dried paste. once upon a time it was running cool. does paste actually move around due to heat/pressure over time? i thin i used as5 back then btw

 

[Idontcare]

it was running 24/7 for around 5 years i think so not surprised it's so dusty. the mobo isn't that bad actually.

IDC - the paste is solid but chipping away. like dried paste. once upon a time it was running cool. does paste actually move around due to heat/pressure over time? i thin i used as5 back then btw

Yeah the paste moves around, the laymen term is "pump-out effect" and it does happen to the vast majority of these 3rd party TIMs we enthusiasts like to use.

^ that is just a schematic of how it happens under the IHS, but it happens between the IHS and the HSF surfaces as well.

The only TIM that I am aware of that purports to not suffer from pump-out is IC Diamond.

Bake out and pump out are well known and documented as primary causes of grease failure. A viable or optimal compound is one that utilizes as little of any kind material (liquids)as possible that would be the central cause of of a TIM joint failure, while at the same time maintaining the best thermal performance possible. With the introduction of IC Diamond Thermal Compound we believe we have managed all the criteria for an optimal TIM by combining both performance and reliability.

The competition compounds feature the formation of voids, and span the range of initial failure to complete failure. IC diamond was observed to have no visible points of failure under these conditions. The picture is back lighted so the void formation is clearly visible

It is a question of practicality though - if the pump-out for AS5 is so slow that it becomes a problem only after 2yrs or so then is it really that much of a problem? After 2yrs you should probably get into your case and clean the dust out of the HSF anyways.

 

[tommo123]

i was lazy until that gen (E6600/Q6600) i had always upgraded both PCs yearly. it was only when conroe came out that i didn't really feel a need to do it.

reump out effect - if the cpu was constantly running @ 100%, then would that exasperate things? as in, not being turned off overnight or whatever.

about a year or so ago, the psu blew and i replaced it - but, due to the cabling etc being a pain, i never actually put the new psu into the case. it rested on a corner of the case. this means that the case was on its side with no cover so i'm guessing this meant more dust fell into the case and sped up the clogging of the fan

ah well, now to see if there's anyone who wants to buy an old cpu/ram/mobo etc

 

[aigomorla]

Needing super low temperatures is another "enthusiast fallacy" to be filed with the other fallacies of needing a super powerful PSU, among others. :whiste:

<----- zap's perfect definition of fallacy holder..