Originally posted by: jodhas
Originally posted by: pm
Look folks, HarryAngel is talking about the physics involved in building fundamental parts of computers.
A process shift from, say, 0.18um to 0.13um isn't as simple as telling every person working out in the fab, "Ok, guys, this week we are going to make everything smaller than we did last week." A process shift is a hideously complex affair involving literally hundreds of companies and thousands of engineers and technicians. At any given point, most of the technologies required for manufacturing chips two generations ahead haven't been invented yet.
I'm a cleanroom engineer. I will not specifically name our clients, but two of our biggest clients boast state of the art FABS in Austin, Texas and Eugene, Oregon.
Jumping from .18um to .13um is not easy. Nor is jumping from 200mm wafer to 300mm wafer. However in both cases, it is not a "hideously complex affair." It does not require hundreds of companies nor thousands of engineers.
I can confidently say this because of the following reasons.
Case 1
In both cases (.18um to .13um and 200mm to 300mm), many FABS around the world are merely "retro fitting" their current fabs to accomodate the new technology. Also, as we jump from .18um to .13um, human presence inside a cleanroom must be minimized. On a typical Class 1 Cleanroom in a FAB, we have a raised floor system with the + and the - airflow design to keep the "large" particles out. Now for the "small" particles, the ceilings are covered with Fan Filter Units equipped with ULPA 99.999999999 Efficiency and up 365 days a year. Now, this is your average Class 1 Cleanroom (very simplified). However, as we jump from .18um to .13um, we need to minimize human presence. Even with the strict cleanroom protocols for gowning and with State of the Art Airshowers, humans are the single biggest source of contamination inside a cleanroom. In order to solve this problem, we minimize human presence by installing what is called the AMHS (Automated Materials Handling System). There are only 2 reliable companies that have the capabilities to these robotic systems. They are Muratec and Daifuku, I think Daifuku won the "Intel's preferred Supplier List." And even this process is not too difficult, for I've seen it first hand in New York's IBM FAB as Muratec installed these systems as they were retro fitting to 300mm technology. Anyhow, so, for "Retro Fitting" we are "upgrading." It's not as impossible and difficult as it seems.
Case 2
Our major client in Austin Texas, will be "retro fitting" as well, to accomodate the .13um technology this Fall. It's a $200Million Project. Respectable cleanroom companies (as well as mine) will bid on this project. I assure you, it does not take thousands of engineers nor hundreds of companies.

. We already commited couple of engineers, salesman to do some cost estimation for this project. $200 cleanroom/FAB is a good sized project, but it is not something hundreds of companies can say "let me have a piece of that pie!" Any respectable cleanroom contractors should be able to finish something like this without too much problem.
Case 3
If not retro-fitting is not an option, and a company wants to build a FAB from the scratch, It still does not take "thousands of engineers" and "hundreds of companies". I know this because MW Zander (company based in Germany) built our clients FAB based in Eugene, Oregon for 1.4 Billion dollars in 1997 and MW zander completed this job with their in-staff engineers and several subcontractors and supplers.
Case 4
And actual development of the .13um technology, it's sort of the same procedure as the .18um and to the contrary of the above quotation, yes the big idea behind .13um technology is simply making it "smaller". I've seen first hand, the tools used (photo, etching, cmp, etc...) for .13um process look very very similar to the ones used in .18um. Tool installation and tool operations were close to being identical as the tools used in the .18um process. I don't know the perfect details of these tools but if the installation, operation, matintenance and physical attributes are almost indentical, would the science behind it be too different? Probably not. I think it's safe for us to draw an analogy of upgrading your duron to an athlon, doubling your ram to 512mb and adding a faster harddrive (provided your mobo can take the athlon), to describe the procedure behind the trastion of .18um to .13um
My point is that, .18um to .13um can be done rather eaily, and most definately, it is not a "hideously complex affair involving thousands of engineers nor hundreds of companies." It's more of an upgrade, based on the same technology.
My point is that anyone who says that there haven't been "great developments" in silicon manufacturing and design in the last 20 years, is standing too far away from the action to see how difficult the challenges are and how impressive the solutions have been. And it's not like the reason that the basis for most semiconductor electronics is silicon is due to the fact that there have been no innovations or developments in finding other materials. The fact is that silicon is the "best" material we have available for manufacturing when economics is taken into consideration.
I haven't been in this area for 20 years but only about 10, so I am humbled as I say what I am about to say. Fundamentally the technology, the idea, the theory, is practically the same as it was 10 years ago. There have been tremendous improvements in the process of chip-making and the environment(FAB) in which they are produced but it is only an improvement not a fundamental change, so I would have to agree with Harry Angel.
I hope I didn't come across as arrogant, I've had trouble in the past for sounding arrogant. If I've offended anybody (especially the person I quoted from, I apologizein advance if I did offend you). But anyhow, as a person who is a little closer to the "field" of chipmaking than an average person, I just wanted to agree with Harry Angel and put in my 2 cents.