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Has anyone here tried lapping their CPU's IHS?

R

Rike

Platinum Member
I found a brief "How to ..." over at Legit Reviews. Don't bother with page two where they start to get stupid. :disgust:

The IHS lapping sounds easy and very low risk except that you kill your warranty.

Experiences/opinions?
 
I did mine. My IHS was seriously concave, and was causing temperature problems.

Lapping the IHS was very easy. I read of dozens of people that have done it, and never read of anyone damaging their CPU (but there's always a first).

But unless your IHS is concave, you might opt to keep your warranty rather than lap.
 
mine was extremely bad and u will see it in the first min of sanding it

its pretty safe and very easy.

sure it killed the warranty but was worth it imo
 
Originally posted by: VinDSL
Bottom line: Intel is still turning out crap CPUs!

Lap or R.M.A -- your choice! 😉
Click to expand...

@ VinDSL: Yum, flame bait. Tasty! I needed a late night snack. :evil:

@ all others: thanks for the feedback. I just got my E6600 and I've got it stress testing with a stock HS for now. I'll check the IHS when I'm ready to get this thing in it's case and decide if it needs it then.
 
Originally posted by: Rike
@ VinDSL: Yum, flame bait. Tasty! I needed a late night snack. :evil:
Click to expand...
Heh!

Look, in Anand's original review of the C2D, et al, 'the man' made reference to the FACT that Intel has been selling 'us' crap for the last 5 years. If you don't believe that, you're living in never-never land. The C2D was suppose to change all that -- O/Cer's dream, and all that sort of stuff...

However, as it turned out, with their rush to supply the market, a LARGE percentage of their CPUs are now being turned out with concave/concave IHSs!

What's the remedy?

Either YOU eat it, and lap -- or, 'they' eat it a R.M.A.!

What other choice is there? Living with an overheating POS?!?!?!
 
I took the ihs off mine, and some people worry about the warranty while lapping.

Just do it and fix those temps!!
 
CPU IHSs are supposed to be concave. The chamber inside almost becomes a kind of heat pipe or phase change device. Intel has a patent out on the technology, someone has already mentioned it.
 
Originally posted by: Talcite
CPU IHSs are supposed to be concave. The chamber inside almost becomes a kind of heat pipe or phase change device. Intel has a patent out on the technology, someone has already mentioned it.
Click to expand...

Linkage for Intel patent please. 😛
 
Originally posted by: VinDSL
Originally posted by: Rike
@ VinDSL: Yum, flame bait. Tasty! I needed a late night snack. :evil:
Click to expand...
Heh!

Look, in Anand's original review of the C2D, et al, 'the man' made reference to the FACT that Intel has been selling 'us' crap for the last 5 years. If you don't believe that, you're living in never-never land. The C2D was suppose to change all that -- O/Cer's dream, and all that sort of stuff...

However, as it turned out, with their rush to supply the market, a LARGE percentage of their CPUs are now being turned out with concave/concave IHSs!

What's the remedy?

Either YOU eat it, and lap -- or, 'they' eat it a R.M.A.!

What other choice is there? Living with an overheating POS?!?!?!
Click to expand...

Don't sweat it; I just think that overstating your case. The IHS problem on C2Ds is a minor manufacturing error, nothing more. It is only of consequence to a very few enthusiasts.

Overstating your case just makes you look like a fanboy. 😉
 
give me a bit to search for it.

Btw, I really doubt they're manufacturing errors. You're telling me a company can etch 65nm grooves into a thin silicon wafer but can't make a piece of nickel plated copper flat? come on =p.
 
Hmm while i was looking for the vapour patent, I came across several other patents. The IHS is designed with a curve to compensate for the expansion of heating and cooling and for structural reasons. The patents are here: 6,848,172 and 7,102,226. I havn't found the vapour patent yet, but I'll keep looking =P

edit: I think I found it. It's not quite what I remember it being, but it does mention the concave structure of the IHS. Patent application 20030197252
 
Nice research, Talcite. :thumbsup:

I read some on patent 6,848,172 and it is clearly a patent for an IHS that is not flat at room temp.

Assuming that the C2D packages use this or similar technology, this raises a new question: If the this process works so well, why would a lapped IHS (flat at room temp) show 2-3C less when all else is equal?
 
Originally posted by: Rike
Nice research, Talcite. :thumbsup:

I read some on patent 6,848,172 and it is clearly a patent for an IHS that is not flat at room temp.

Assuming that the C2D packages use this or similar technology, this raises a new question: If the this process works so well, why would a lapped IHS (flat at room temp) show 2-3C less when all else is equal?
Click to expand...


Having a concave/convex IHS is NOT ideal for low temps, it is ideal for high temps.
(Temps high enough where the IHS would then flatten out, increasing surface area in contact with the heatsink and therefore also increasing the amount of heat that can be transferred to the heatsink per unit time).

IF you keep your processor cool enough where the IHS would not change shape (and i'm guessing that 99% of us do), then you would get better thermal performance out of a flat (lapped) IHS.

 
So that just means if your temps rise (i.e cooling deteriorates) and your cpu is lapped, then your cpu fails =P.
 
not to be mean, but I would think the team of PhDs who spent years researching this have a bit more credibility than you =/.
 
Originally posted by: ebaycj
Originally posted by: Rike
Nice research, Talcite. :thumbsup:

I read some on patent 6,848,172 and it is clearly a patent for an IHS that is not flat at room temp.

Assuming that the C2D packages use this or similar technology, this raises a new question: If the this process works so well, why would a lapped IHS (flat at room temp) show 2-3C less when all else is equal?
Click to expand...


Having a concave/convex IHS is NOT ideal for low temps, it is ideal for high temps.
(Temps high enough where the IHS would then flatten out, increasing surface area in contact with the heatsink and therefore also increasing the amount of heat that can be transferred to the heatsink per unit time).

IF you keep your processor cool enough where the IHS would not change shape (and i'm guessing that 99% of us do), then you would get better thermal performance out of a flat (lapped) IHS.
Click to expand...

That sounds reasonable. I'm temped to kick this over to the "Highly Techincal" forum and see what the brains over there come up with, especially because this discussion has gone a little off topic from my original post.
 
Originally posted by: Talcite
not to be mean, but I would think the team of PhDs who spent years researching this have a bit more credibility than you =/.
Click to expand...

You mean like when they thought slot processors were better, and I didn't buy into that? Or maybe you mean when they thought Rambus memory was going to be the next big thing? I thought that was a bad idea also. Who was right?

Let's not forget that Intel also thought clock speed was all that mattered for awhile. I got an AMD then. How about when they thought that Itanium didn't need backwards compatibility with 32 bit software. How well is Itanium selling compared to Opterons? Or that no one wanted or needed 64 bit chips for desktops; they're using AMD's 64 bit instructions now.

Everyone who had lapped their heat spreader has gotten better results. I've heard of no one, that did it right, that had their temperatures rise. All the evidence I've seen show that Intel is wrong on this also. A PhD doesn't make someone right.

Show me some reviews and stats were having a non-flat heat spreader improves temperatures.

 
Originally posted by: VinDSL
Originally posted by: Rike
@ VinDSL: Yum, flame bait. Tasty! I needed a late night snack. :evil:
Click to expand...
Heh!

Look, in Anand's original review of the C2D, et al, 'the man' made reference to the FACT that Intel has been selling 'us' crap for the last 5 years. If you don't believe that, you're living in never-never land. The C2D was suppose to change all that -- O/Cer's dream, and all that sort of stuff...

However, as it turned out, with their rush to supply the market, a LARGE percentage of their CPUs are now being turned out with concave/concave IHSs!

What's the remedy?

Either YOU eat it, and lap -- or, 'they' eat it a R.M.A.!

What other choice is there? Living with an overheating POS?!?!?!
Click to expand...
I shall paraphrase:

- Intel sells crap for past 5 years
- C2D is supposed to be great
- C2D has concave IHSs
- All C2Ds are overheating POSs
- Pronouns have apostrophe marks around them
 
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