got a heating problem....I think :)

whateverdude

Senior member
Oct 6, 2000
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I just got a S1 P3 800e/100. lapped it, put on an alpha p3125 with artic silver paste. I have a be6-2 mobo and have the hardware monitor software installed that uses the winbond chip to give me system temp, cpu temp etc. my cpu temp usually runs around 30 C, but when I run a cpu benche using sisoft sandra, it will jump up to like 90 C. is it supposed to do this?

also, I have not been able to get my system to boot oc'ing this at all. i've tried different fsb speeds, upping the voltage. nothing works.

I am at a loss here, I could oc a p3 550 katmai with this same setup to at least 600 and it was stable and I would think the coppermine would oc more. do I maybe have a non-oc'er?

here's my system specs:

be6-II rev 1.01
128 apacer infineon pc133
V5 5500
30 gig maxtor hd
mx300
creative cdrom
acer cdrw

my computer is in the basement and its plenty cold down here right now and the sides are off my case and have fans moving air through it.

I appreciate any help offered as I thought I would at least be able to get 900 or 950 out of this chip.
 

Mikewarrior2

Diamond Member
Oct 20, 1999
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if your heat is jumping to 90C during testing, I would suggest remounting the heatsink. It seems as though the heatsink-cpu connection isn't very good.



Mike
 

whateverdude

Senior member
Oct 6, 2000
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thanks, i'll try that. I just ran a drive benchmark and left the hw monitor in view while it was running and while it was running the temp just kept climbing and climbing till I finally stopped it. thats not good :)

although, I ran through NOLF demo for a little bit and it didnt crash or anything.
 

kengsim

Junior Member
Dec 24, 2000
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If I were you, I wouldn't try overclocking the thing first until I can resolve whatever's making the chip go up to 90C. At the temp, it's not going to last very long.

Try reseating your HSF properly and use a little thermal paste. Don't put more than an average nose-picking yield. The stuff would just be squeezed out the sides. Your HSF combo would be adequate for the job.

In any case, I suspect that it's not the heatsink's problem. If it's really not seated properly, you won't see an idle temp of 30. It would be much higher. But I can't think of anything that would propel your temps to over 90C on max load. That's really weird...
 

kengsim

Junior Member
Dec 24, 2000
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Hang on, you LAPPED your coppermine processor??? You're not supposed to do that to Coppermine chips! PPGA chips are fine, but not on FCPGA ones. Get ready to buy another CPU.
 

Mikewarrior2

Diamond Member
Oct 20, 1999
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Kengsim,

what are you basing that on. P3-coppermines are lap-able, but only with care.

My p3-650@988 is lapped, and it has worked fine for 7 months.



Mike
 

whateverdude

Senior member
Oct 6, 2000
514
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ok, well, after reseating the alpha with no results, I put the retail hs/f back on and its now running at 944/1.8v. ran cpu and drive benches in sandra and it barely cracked 50 C the throughout both benches. idles in the upper 20's to mid-30's.

I guess I have a bad alpha :( who knows. what I suspect is that I was not able to get the alpha to tighten good enough. I put the screws down as far as I could and even though it was tight, it did move a little bit and I think that may be the problem.

have been trying in vain to take it to 1 ghz. went all the way up to 1.9v and it still wouldnt boot.

any ideas?

kengsim: its a slot 1

thanks for all your help guys!
 

whateverdude

Senior member
Oct 6, 2000
514
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yes, its copper. I tried lapping that a little too because it had some ruts in it and that didnt do anything either.

well, it wont boot any higher than 944:( even when upping the voltage.

I might try buying a new hs/f and see if that does the trick. whats the best slot 1 hs/f?
 

whateverdude

Senior member
Oct 6, 2000
514
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do you think I should try setting my ram cas settings to 2? all 3 are on setting 3 right now. I might pick up a stick of that mosel ram from scorp1gee and see if that helps.
 

kengsim

Junior Member
Dec 24, 2000
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The main reason for flip chip packaging was to put the core on the outside, to assist in heat dissipation. The layer of whatever that they put on it is very thin, and lapping is err... dangerous. Not recommended unless you're VERY careful.

Oh well.