I just got a new processor with a HSf. The stock HSF already has some thermal compound(not pad) applied to it. I read somewhere that it is of low quality and is good to take off... and Arctic silver applied. Do you guys agree. If yes should I just remove it with a cloth and some isopropyl alcohol.
Also when applying new As5, the website intsructs to put it only on top of the processor heat spreader and not on the heat sink base. Do you guys agree with that? Any comments will be appreciated. I am just a little too careful as it is my first build.
Also when applying new As5, the website intsructs to put it only on top of the processor heat spreader and not on the heat sink base. Do you guys agree with that? Any comments will be appreciated. I am just a little too careful as it is my first build.