- Feb 7, 2010
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With each new generation of flash the features sizes get smaller permitting greater density and storage, but it also comes with the penalty of shorter life owing to the limited number of write cycles. Going forward it would seem the lifespan will quite soon get to be an actual problem that limits further density increases.
One technique I've heard about that appears to undue the damage is thermally cycling the device but if that works, how could this be implemented to repair a device in situ? If the thermal cycle can be of short duration it's possible the modules/chips could have a heater built into them and, periodically, the devices are heated, but, I would imagine that you'd have to assume all memory to be lost in the process.
So, has anyone heard more on this...
Brian
One technique I've heard about that appears to undue the damage is thermally cycling the device but if that works, how could this be implemented to repair a device in situ? If the thermal cycle can be of short duration it's possible the modules/chips could have a heater built into them and, periodically, the devices are heated, but, I would imagine that you'd have to assume all memory to be lost in the process.
So, has anyone heard more on this...
Brian