Keysplayr
Elite Member
Originally posted by: twjr
What about moving from binary to trinary (btw I have no idea if its even possible just want to throw it out there)?
What would that be? One's, Zero's and Quark's? 😀
Sorry. Please go on guys.
Originally posted by: twjr
What about moving from binary to trinary (btw I have no idea if its even possible just want to throw it out there)?
Originally posted by: Keysplayr
Originally posted by: twjr
What about moving from binary to trinary (btw I have no idea if its even possible just want to throw it out there)?
What would that be? One's, Zero's and Quark's? 😀
Sorry. Please go on guys.
Originally posted by c2418 of arstechnia:
You probably shouldnt care about the trolls and their FUDs. I thought that AMD has better things to do than employ someone to search around internet and try to intimidate people, but obviously they follow in RIAA footsteps. Good for them, I hope they choke on their secrets.
Anyway, I'm also interested in more compact design, this one is rather confusing. But it seems kinda netbursty to me, like hat monster said. However, netburst had a lot less paralelism IIRC.
What's the pipeline lenght? Also, what do you mean by "FP scoreboard", is it the classic scoreboarding (the old one) and shouldn't that be obsolete with speculation and renames? But I can't see if it's using any speculation at all from the image.
So, when we're at it (ISA discussion, that is) do you arstechnicars know anything about new cortex? They say it's "out of order" but do they mean dynamic schelduling or speculation? In is dynamic schelduling without speculation any good?
EDIT: or if you don't want questions about ARM in discussion about your architecture, I can move it elsewhere.
Originally posted by: twjr
Originally posted by: Keysplayr
Originally posted by: twjr
What about moving from binary to trinary (btw I have no idea if its even possible just want to throw it out there)?
What would that be? One's, Zero's and Quark's? 😀
Sorry. Please go on guys.
If you look at the Wiki link IDC gave me for ternary computing the way it was presented there was -1, 0 and +1. But like I said I really have no idea what I'm talking about. Was really throwing it out there to see if anyone could comment on it so as to expand my knowledge.
Originally posted by: Idontcare
Originally posted by: Ben90
i was reading way long time ago that pretty soon we arnt going to be able to shrink the xtors anymore and after that the only way to increase performance will be through a more efficient architecture or through physically increasing die size; obviously both of these have their limitations as well such as the speed of electricity, so i was wondering if there is any talk of development of stuff like 3D cores or like multi layered cores and how possible/probable/realistic it is for something like that to happen
obviously this wont be looked into seriously for at least a decade or more but it seems we are hitting a physical wall and pretty soon we might need a fundamental change of how things are made and just wanna hear ur take on it because you know a lot more than i do lol
Intel and Samsung have both said shrinking down to 5nm region is possible, but obviously regardless what the actual number is for shrink limits there will come a day when we hit it, so then what?
The 3D architecture model is intriguing, and doable. Early commercial implementations will be most feasible on simple designs of course, namely memory.
Elpida Develops 3-D Stacked 8-Gbit DRAM
That is an early example of a functional method to implementing 3D IC's with TSV (through-silicon via). An even earlier example exists in the flash world where chips were stacked (but separately wire-bonded) within the package.
So it is happening, the fabrication techniques are being developed, optimized, improved upon every year. For high-performance logic CMOS the design tools need to be much more mature to make it a practical second-choice versus traditional 2D design. So many issues need to be addressed by the validation software from thermals to electrical cross-talk, power distribution, etc.
But it is feasible and will become more and more practical over time as the field matures.
The 4 Horsemen of 3D IC
Two areas in particular are on the critical path for volume production of 3D TSV integrated circuits: Design for Manufacturing (DFM) and Design for Test (DFT).She offered the following of a 3D EDA roadmap. By 2010 /11, architectural evaluation engines will need to be available to break out of incremental, evolutionary growth. At some point in the near future, and hopefully before 2013, there will be standards in place for test and 3D IP component compatibility.
http://www.semiconductor.net/b..._Horsemen_of_3D_IC.php
Originally posted by: magreen
I'd bet there's < 5 registered members of AT who can read that schematic.
And their names are:
I lol'd.Originally posted by: Ben90
I believe i may have come up with a more efficient design:
http://i27.tinypic.com/34j4qo2.jpg
Originally posted by: Idontcare
Hard Ball - if you find my continuing to entertain this side-topic within your thread to be more nuisance than supportive of the thread then please just let me know (pm works) and I'll start a new thread instead of cluttering yours. 😉