Originally posted by: isekii
What does it mean "reflow the chip" ?
BGA chips have an array of solder balls on the bottom, once they're placed on the pads of your circuit board, you send it through a reflow oven to melt the solder and form interconnects. In this case the interconnects were mechanically broken, and you'd be re-melting the solder to hopefully re-form the solder joints.
The techs who repair these things would have special rework stations with a lot more accuracy in delivering heat and re-aligning chips, and the cameras/optics to actually see what they're doing. A homebrew repair seems difficult at best, but if the pitch is relatively large, *and* you didn't get knocked very far out of alignment relative to your pads, *and* you can avoid damaging something else on the card with your heat application, I guess you have a chance. The surface tension of molten solder joints can self-align the chip to some degree, which is probably why this works at all. But if your solder bumps are offset on the pads by 1 row or something before you melt them, obviously you're screwed. Good luck.