As I do not have a good camera at hand, I can not provide pictures. But in my earlier attempt at getting my system up and running (my AW9D Max went to RMA) when I installed the CPU and applied quite a lot of pressure on it, it caused some dents in the gold pads of the E6600's gold pads. Looking through a magnifying glass this looks like a tale of horror. Dents in the gold pads, connectors having not connected in the middle of the gold pad (resulting in some having three marks due to reinstallation of the cpu), and some gold pads do not have any mark at all.
My question then is; is this normal for LGA775 CPUs? should there be dents in the gold pads? and should not each pin always hit the center of the gold pad?
Worried that I will get back a functioning motherboard, but have a CPU that will cause problem due to damage to the gold pads.
My question then is; is this normal for LGA775 CPUs? should there be dents in the gold pads? and should not each pin always hit the center of the gold pad?
Worried that I will get back a functioning motherboard, but have a CPU that will cause problem due to damage to the gold pads.