- Apr 27, 2002
- 6,278
- 6
- 81
I just looked on Anandtech and saw a review for a case. Granted I didnt know it was a case review, it looked more like PSU review from the healine to my university-fried brain but one of the positives was a 'Patented Wind Tunnel' I think.
In my mind, Id toyed with a windtunnel design, a true dedicated tunnel from the front of the case to the back of the case, enclosing the CPU/heatsink and RAM arrangement. Great idea except I never saw how to implement it until today.
The CPU sits quite behind the 5 1/4" bays and less than 1" away from the PSU in my generic case. Not great but i dont complain, it works. Other people may have better success with cooling but for people who want silence and decent performance, its murder.
Quite frankly, I like the idea of tipping the motherboard upside down. Most intakes are at the front on the bottom..... an 80mm intake blowing directly over the ram and then onto the CPU isnt ideal (air can warm up from the RAM) but it would seem to be more convenient. PCI cards would be closer to the PSU which isnt so much of an issue I dont think. The majority of PCI cards currently and in the near future I dont see them putting out as much heat as a CPU. The AGP card would be situated roughly in the centre as usual which doesnt seem here nor there.
Exhaust would probably have to be at the bottom though. With the PSU at the top providing some exhaust, I can forsee some PSU problems but Im sure theres a workaround.
It just occured to me about PCI-e or PCI-x (the consumer version, it confuses me as much as AMD after Socket A). Id guess a PCI-E GFX card would or could go into any slot it liked therefore a PC's specific heat configuration could be modified slightly.
One idea could be to make 2 part motherboards. Say a separate or integrated motherboard lying accross the bottom of a tower case and having the CPU/RAM there with the meat (slots) on the side, mounted to the case. Very dodgy for motherboard designers but quite frankly.... if Dual Core doesnt solve or help the heat issue, we must make air cooling more efficient, have people fry their pc's with watercooling or have someone like Dell make a system for us with watercooling installed. (not that Dells are awful, made by Elcs PC's are of a better standard as would most self-made PC's on these boards)
Im in Uni now so I cant finish this off or take part in any discussion but Id appreciate any contructive criticism or a pat on the back. Id like to keep any flames away.... this is quite an ambitious idea and one which Im not sure would be great. PSU cords and placement on motherboards would be awful, especially if you clamp a 5kg paper weight to your processor and find it difficult fitting it around capacitors, nevermind being able to plug things in easily. Im probably called a bit haphazard in the way my mind works, I scatter ideas down and work on them. They are rarely user-friendly.
Any queries, Id prefer to be on this thread and not through PM because someones criticism may lead to this idea becoming more refined and actually seem really viable.
In my mind, Id toyed with a windtunnel design, a true dedicated tunnel from the front of the case to the back of the case, enclosing the CPU/heatsink and RAM arrangement. Great idea except I never saw how to implement it until today.
The CPU sits quite behind the 5 1/4" bays and less than 1" away from the PSU in my generic case. Not great but i dont complain, it works. Other people may have better success with cooling but for people who want silence and decent performance, its murder.
Quite frankly, I like the idea of tipping the motherboard upside down. Most intakes are at the front on the bottom..... an 80mm intake blowing directly over the ram and then onto the CPU isnt ideal (air can warm up from the RAM) but it would seem to be more convenient. PCI cards would be closer to the PSU which isnt so much of an issue I dont think. The majority of PCI cards currently and in the near future I dont see them putting out as much heat as a CPU. The AGP card would be situated roughly in the centre as usual which doesnt seem here nor there.
Exhaust would probably have to be at the bottom though. With the PSU at the top providing some exhaust, I can forsee some PSU problems but Im sure theres a workaround.
It just occured to me about PCI-e or PCI-x (the consumer version, it confuses me as much as AMD after Socket A). Id guess a PCI-E GFX card would or could go into any slot it liked therefore a PC's specific heat configuration could be modified slightly.
One idea could be to make 2 part motherboards. Say a separate or integrated motherboard lying accross the bottom of a tower case and having the CPU/RAM there with the meat (slots) on the side, mounted to the case. Very dodgy for motherboard designers but quite frankly.... if Dual Core doesnt solve or help the heat issue, we must make air cooling more efficient, have people fry their pc's with watercooling or have someone like Dell make a system for us with watercooling installed. (not that Dells are awful, made by Elcs PC's are of a better standard as would most self-made PC's on these boards)
Im in Uni now so I cant finish this off or take part in any discussion but Id appreciate any contructive criticism or a pat on the back. Id like to keep any flames away.... this is quite an ambitious idea and one which Im not sure would be great. PSU cords and placement on motherboards would be awful, especially if you clamp a 5kg paper weight to your processor and find it difficult fitting it around capacitors, nevermind being able to plug things in easily. Im probably called a bit haphazard in the way my mind works, I scatter ideas down and work on them. They are rarely user-friendly.
Any queries, Id prefer to be on this thread and not through PM because someones criticism may lead to this idea becoming more refined and actually seem really viable.
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