So I'm curious has anyone heard anything about if intel is putting heat piping in the coming generation of there CPU's?(just read on the new ones)
By that, like the samples last gen had.....
That were running cooler than the release version....
Heat channeling with copper/other running in the die.....
Heat(plate(copper other liner,area around silicon edge.
... Just had the thought the green substrate looked rather large.....
Back to it though anyone heard yet?
By that, like the samples last gen had.....
That were running cooler than the release version....
Heat channeling with copper/other running in the die.....
Heat(plate(copper other liner,area around silicon edge.
... Just had the thought the green substrate looked rather large.....
Back to it though anyone heard yet?