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CPU Internal Cooling

C

chewy0914

Member
So I'm curious has anyone heard anything about if intel is putting heat piping in the coming generation of there CPU's?(just read on the new ones)

By that, like the samples last gen had.....
That were running cooler than the release version....


Heat channeling with copper/other running in the die.....
Heat(plate(copper other liner,area around silicon edge.
... Just had the thought the green substrate looked rather large.....
Back to it though anyone heard yet?
 
There's been speculation that we might see that sort of thing someday, but there's been zero indication that we'd see that with anything on their roadmap. Same with AMD. I don't know if it's even been done at an academic level.
 
IBM was working on something along these lines if i'm not mistaken.
I think they were pumping water thru the IHS or something similar on their highend server chips. As far as inside the die itself i'd be surprised if they havn't researched/tested it internally ... My thinking is it's just not financially practical.
 
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