Hey,
I'm sorry for making my first post a new thread. But I'm in a bit of a bind and need some urgent advice. 🙂
Long story short. On friday I decided I wanted to try and replace the thermal paste on my i5 3570k + Scythe Mugen 2 cause my OC was running a little hotter than I hoped it would. In the process of doing this, some thermal paste (the one that was already on the cpu) spilled into my socket and by trying to remove it several pins were bent and 1 was broken (don't ask 😛). Eventually, I was able to clean most of the goop and bend the bent spring back in their place (I estimate with a 95 - 99% accuracy). There is still a little bit of paste on the bottom and on the "legs" of the pins.
After fixing the socket as best I could, I put my PC back together and it seems to be doing just fine. I have been stress testing and game testing it ever since and it's behavior seems identical to before. It was clocked at 4.5 ghz using 1.2 volt. The voltages at idle (1600 mhz) and at load look identical as before. Haven't had any unexpected behavior as far as I can tell. edit: The only thing I've noticed is the cpu running 1 - 2° warmer than before, but this can easily be attributed to the new AS5 paste and it's curing time.
Now my question is. What risks am I facing by still using this mobo?
- Is there any risk of damage other components?
- Any risks of the mobo still failing?
- Any hidden issues that I might not be noticing, but are still there?
- No risks?
Thanks in advance.
I'm sorry for making my first post a new thread. But I'm in a bit of a bind and need some urgent advice. 🙂
Long story short. On friday I decided I wanted to try and replace the thermal paste on my i5 3570k + Scythe Mugen 2 cause my OC was running a little hotter than I hoped it would. In the process of doing this, some thermal paste (the one that was already on the cpu) spilled into my socket and by trying to remove it several pins were bent and 1 was broken (don't ask 😛). Eventually, I was able to clean most of the goop and bend the bent spring back in their place (I estimate with a 95 - 99% accuracy). There is still a little bit of paste on the bottom and on the "legs" of the pins.
After fixing the socket as best I could, I put my PC back together and it seems to be doing just fine. I have been stress testing and game testing it ever since and it's behavior seems identical to before. It was clocked at 4.5 ghz using 1.2 volt. The voltages at idle (1600 mhz) and at load look identical as before. Haven't had any unexpected behavior as far as I can tell. edit: The only thing I've noticed is the cpu running 1 - 2° warmer than before, but this can easily be attributed to the new AS5 paste and it's curing time.
Now my question is. What risks am I facing by still using this mobo?
- Is there any risk of damage other components?
- Any risks of the mobo still failing?
- Any hidden issues that I might not be noticing, but are still there?
- No risks?
Thanks in advance.
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