Best way to apply AS5?

[Synomenon]

So what's the best way to apply AS5? Arctic Silver's website says to put a blob the size of a grain of rice on the middle of the processor. Some places I've been to say to spread the compound evenly on the processor. Just asking 'cause my Pentium D 940's temps. are around 62 degrees C after running Memtest 86+ for a couple of hours and then restarting, going into the BIOS and checking the CPU's temp.

 

[Luckyboy1]

theories abound, but they make the stuff. What do you think?

 

[Kakumba]

I stick to what they say. I guess you could spread it a little if you REALLY want to, but methinks that they know what they are talking about (AS that is). so, until Anandtech or other does scientific testing to prove otherwise, stick to the blob method.

 

[JSFLY]

rice method works because you wont get the air pockets that you do spreading it out yourself.

 

[Ricemarine]

I spread it out because I want to make sure the core is fully covered.

But I used to do the blob method.

 

[furballi]

Do both. A very thin layer, then a small deposit of AS5 at the center of the CPU. Win-win solution.

 

[Kakumba]

Im not sure that spreading then blobbing will eliminate the air pockets.... would be keen to see some real test results now.

 

[Synomenon]

Yeah, I'm thinking the blob method works better since that would probably eliminate air bubbles, BUT I see other forums where people say that spreading the compound is better. I wish one of these tech sites would do some kind of scientific analysis on this.

 

[OmniShinzui]

I used the blob + spread method. When I ran my build for the first two days I was getting 20c on idle and 32c on load (AMD X2 4400+ Stock/Default everything).

I dunno why, but now its running 40c idle and 48c load... Nothing changed tho... Then again, im not sure how accurate Everest is...

 

[JEDIYoda]

I use a mixture of baking soda and flour with honey and a little sour cream.

Gives me the same results as AS5!!

hehehee J/k...lol.....April Fools!!

 

[JimPhelpsMI]

Hi, It's pretty difficult to judge the size of the necessary BLOB. I prefer spreading it thinly over the entire contact area. The excess will be squeezed out using either method and you will end up with the same amount still in the space, but the blob may be way too much and get all over the processor and MB when it squeezes out. You really only need enough to fill in any minor imperfections in the two surfaces. Jim

 

[Kakumba]

yeah, that is always a concern, moreso when you use the spread and blob method, as you are adding 2 lots of TIM. oh well, thats why you practise, and get experience....

 

[n7]

I don't do it how they say, since it doesn't spread over the whole IHS like they say it does.

I do a couple tiny blobs + spreading around, except the sides.
Then when i remove HSF, it's usually a thin layer all over the IHS.

 

[robertk2012]

If the IHS is on then use the blob method. If you remove the IHS or are using a cpu without a IHS like the Athlon XPs then feel free to spread.

 

[SilverMirage]

The other step (no idea how important exactly) is to clean both the HS and the core/spreader very well before applying grease - I don't think it'll make a difference more than a degree, but why not - if you are considering the method of applying, you might as well do everything right.

 

[NaOH]

Blob FTW

 

[Kakumba]

yeah, cleaning is important. maybe a little lapping? just to get a perfect bond?

 

[Synomenon]

The thing with spreading is that if you spread it over the whole contact area of the CPU, there may be just enough that gets "squished" out from between the CPU and HSF that could get on the motherboard / on the CPU socket. With the little blob in the center (blob the size of a grain of rice), it spreads out over the area above the CPU core I think. There is not enough AS5 in that blob to get spread out past the sides of the CPU, at least for the latest processors.


Any other thoughts on this?

 

[tjaisv]

yeah you have to stick ur tube on the motha cpu and then squirt ur artic load, spreading it around so that the cream just barely covers the whole core

 

[aigomorla]

Originally posted by: furballi
Do both. A very thin layer, then a small deposit of AS5 at the center of the CPU. Win-win solution.

Too much AS5 makes your temperature rise. So dont put too much. And people should really read the manual on AS5's web site. This is a classic question which never seems to die

So for all you noobs here it is once more:
Instructions on AS5

 

[Kakumba]

I think a grain of rice sozed blob will easily cover the bit above the ship itself, which is actually all you nreally need. however, because it seems we are questing for perfection, I would actually apply it in 2 stages. stage 1, a blob, and then put the HSF, or whatever CPU cooler you are using, on. leave it for a few days, then take it off, and if need be, apply more, otherwise just put it back on. or remove some if you got as "enthusiastic" as the post above.

 

[Supervexi]

That sounds good, in theory, but when you remove your heatsink, you are causing air bubbles. Think silly putty that you tear apart and then smash back together. It takes a while to get those bubbles out when you play with the stuff. When you replace the heatsink, you will be creating these same pockets of air, but once on, the heatsink doesn't move around, so those pockets will remain.

At least, that's how it seems to me, and from what I saw with my heatsink installation where I put it on and took it off a few times.

 

[Synomenon]

Up for views...

 

[l33tSodas]

Originally posted by: JSFLY
rice method works because you wont get the air pockets that you do spreading it out yourself.

 

[letdown427]

http://forums.anandtech.com/messageview...atid=28&threadid=1793922&enterthread=y

Fair bit of info in there too. I'd say blob in the middle, and when you squash HSF on, twist it back and forth a couple of degrees.