The Sauce
Diamond Member
Ever since I installed my XP-1700 with the SK-6 I was having heat problems - temps upwards of 50C at idle and crashes. I did a complete breakdown and rebuild and when I took off the SK-6 i found condensation between the h/s and CPU and all over the surface of the CPU. Initially I thought it was a problem with my Arctic Silver compound. Then I realized that it was actually the little foam pads on the CPU that were the problem...they were too stiff and not allowing good contact between the h/s and CPU. This resulted in condensation between the h/s and CPU! BAD BAD BAD! The SK-6 clip is pretty damn stiff too. I took a razor and shaved off some of the pads and now temps are about 15 degrees cooler...37C after running 3dmark2001 for about a half hour. Suddenly everything is stable again 😉
Just thought some of you might find this information useful...I never would have thought of it had I not completely broken down the system.
Just thought some of you might find this information useful...I never would have thought of it had I not completely broken down the system.