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AS3 vs AS5

F

fbrdphreak

Lifer
Hello all,
Getting an MSI K8N Neo Platinum shortly and when I reseat my CPU/HSF, is there ANY reason why I should buy some Arctic Silver 5 when I have a tube of AS3 laying around from my last upgrade? Thanks in advance
 
In fact I would stay away from AS5...it has caused some people to pull there cpu out of the socket..wish I had heard about this before using..I would have stuck with my AS2...I have seen no big temp differences
 
5 is like tar goes on sticky, 3 goes on like peanut butter....very nice to work with. Temp differences were not noticable for me.....

m 🙂
 
AS5 that has caused the cpu to be "pulled out" was from people pulling on it 🙂 (obviously)

if its applied right this really doesnt happen, it happened for people who did it wrong. all AS5 needs is a little dot and the HS goes right on top and gets clamped down. it spreads on its own due to the pressure from clamping down the HS...it does not get spread out evenly like other thermal pastes. and its easier to remove while hot(er than room temp) and just dont pull straight out. slide a little.
 
Originally posted by: fixxxer0
AS5 that has caused the cpu to be "pulled out" was from people pulling on it 🙂 (obviously)

if its applied right this really doesnt happen, it happened for people who did it wrong. all AS5 needs is a little dot and the HS goes right on top and gets clamped down. it spreads on its own due to the pressure from clamping down the HS...it does not get spread out evenly like other thermal pastes. and its easier to remove while hot(er than room temp) and just dont pull straight out. slide a little.
Click to expand...


Exactly, most of it is always user error :laugh:
 
well how long has it been sitting around, AS3 will seperate with time and loose much of its ability to transfer heat. depends on how you stored it, and for how long. check it before appling it, it might be liquidly.
 
Originally posted by: AWhackWhiteBoy
well how long has it been sitting around, AS3 will seperate with time and loose much of its ability to transfer heat. depends on how you stored it, and for how long. check it before appling it, it might be liquidly.
Click to expand...

um....no.
Like any mix of particles that are many times heavier than the suspension fluid, there will be some separation in the compound over time when stored in the original syringe. (All thermal compounds eventually experience some separation in storage.) This does not affect the performance of the unseparated or remixed compound.
Click to expand...
link
 
if he doesn't know any better and doesn't apply it elsewhere,mix it, then put it on the core, or gets more liquid than solid then yes,it will. it will affect the ratio of solid to liquid.
 
that link was great. i totally forgot that applying AS would be diff on an A64 than an AXP. haven't applied any thermal goop since my barton....
 
Originally posted by: fixxxer0
AS5 that has caused the cpu to be "pulled out" was from people pulling on it 🙂 (obviously)

if its applied right this really doesnt happen, it happened for people who did it wrong. all AS5 needs is a little dot and the HS goes right on top and gets clamped down. it spreads on its own due to the pressure from clamping down the HS...it does not get spread out evenly like other thermal pastes. and its easier to remove while hot(er than room temp) and just dont pull straight out. slide a little.
Click to expand...

I am sure user error is always a part of the problem..but there should be a warning..some very good guys around who tinker alot..have had issues while being very careful

I applied as instructed a 3/4BB size in center of the A64 IHS and applied my XP90...but there is very little room to slide this HS around if I need to remove...I still would never have used AS5 if I knew this..why have any risk
 
I really don't see the how the grain of rice on top will dissipate heat better, than with the compound spread over the entire surface, especially if the thin layer is applied correctly. I know that it gets clamped down and spreads out but, but with the rice method, the coverage is not 100%. I have seen photos after a clampdown. You will get more heat transfer if 100% of the surface to surface contact is achieved. I have always been leary of the rice method, although the Arctic Silver experts will know best. It just doen't seem to make alot of sense to me. I have always covered the entire surface to make sure the contacting surfaces are 100% in thermal contact and have always had low temps. The less resistance to heat flow the better......

m 🙂
 
the thing is, the silver area ontop of the A64 chips is not the core, but the Heatspreader and the core is much smaller, underneath that. its only neccessary that the AS5 covers the core, in which it does. im using ceramique now but am unsure whether or not to change to AS5 in a week or so - a friend and i may be buying the big tube of AS5, but maybe well look for the big Ceramique tube instead... ah well. shouldent have to take the HSF off much anyway.
 
While that is true it is still inefficient. Heat will transfer from the core to the CPU cap, but if the cap has a potential to contact the sink 100% and in reality only 80% of it does, the transfer is not optimal. The areas of the cap that are not touching will store heat rather than transfer it. I would say 100% contact will move all the heat off the cap and be optimal.

m 🙂
 
Originally posted by: Mucker
I really don't see the how the grain of rice on top will dissipate heat better, than with the compound spread over the entire surface, especially if the thin layer is applied correctly. I know that it gets clamped down and spreads out but, but with the rice method, the coverage is not 100%. I have seen photos after a clampdown. You will get more heat transfer if 100% of the surface to surface contact is achieved. I have always been leary of the rice method, although the Arctic Silver experts will know best. It just doen't seem to make alot of sense to me. I have always covered the entire surface to make sure the contacting surfaces are 100% in thermal contact and have always had low temps. The less resistance to heat flow the better......

m 🙂
Click to expand...
heat only transfer from the area right around the core, or in otherwords the part cover in paste.
 
Yes, but wouldn't it be better to remove heat off of 100% of the area of heatspreader and onto the sink than 80% of the area? The unpasted area will have poor contact with the sink. The smaller the area of contact the greater the resistance to heat flow.....kind of like the difference between a bathtub with a 1" drain hole and one with a 4" drain hole. The 4" is going to transfer at a much greater rate......

m 🙂
 
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