I will again pop back the post on SemiWiki:
https://www.semiwiki.com/forum/content/3884-who-will-lead-10nm.html
GloFo/Samsung Process is 2.2 times denser than 28nm TSMC.
Lets think about it for a second. 600 mm2 Die from TSMC like Fiji would be... 250mm2 on 14 nm. It is extremely close to that 232 mm2 die size.
Whats more, if reality turns out to be true with what AMD says about the architecture, it is cleaned up, revamped and redesigned same GCN architecture. It would also affect the density of the chip. Coincidence? Of course, apart from my educated guesses/guesses I do not have anything to prove it.
But think about it. What better way for AMD would be bringing VR performance to Pitcairn price/performance bracket? They can also cut it to 3072 GCN cores, and still have VR GPU.
I will not talk about performance/SIMD because we do not know anything apart from words from Mahigan on that side, but we may be really surprised...
Imagine a 3072 GCN4 core GPU with 199$ price point matching in performance Titan X...