application of thermal paste - what is the correct technique

[graysky]

If you read the instructions on AS5's site, they show you to make a thin line across the thermal spreader and squish is down with the HS. If you read the instructions on thermaltake's site, they tell you to make a thin layer on both the thermal spreader and the HS. What technique did you use and did you end up with good results?

 

[Ayah]

One tiny dab on the HS, one dap on the chip.

 

[RallyMaster]

I just do one 4 mm dot on the IHS of the chip and throw on the heatsink. I've been doing the same thing for single core as well as dual core...

 

[Zepper]

There's no one correct technique. It depends on the chip (basically whether it has a heat spreader or not, the heat sink and what the goop mfr recommends for the specific product. Most of the top mfrs have web sites with instructions. But a fairly common method on heat spreader chips is the pea-sized blob of goop, press down evenly and when the HS and chip contact, bed it in with a slight twist in both directions. Clean off any excess that squeezes out around the edges and check on occasion to see if more has come out.

.bh.

 

[nataku00]

I usually put a small dab in the center of the cpu's heat spreader, wrap some plastic saran wrap around a finger and smooth it out as thin as I can get, then install the hsf on top of it.

 

[graysky]

Cool, thanks for the replies, all. I'll try the small amount on the IHS method (as per AS5's instruction) and see how that works.

 

[Atty]

+1 for Small dab on the IHS.

All I did for my Core 2 HSF install was dab on the middle then apply my heatsink, twist a little bit, and then install.

 

[idiotekniQues]

my shin etsu arrived today.

im guessing they have instructions on a web site for them?

it didnt come with any paperwork.

 

[Zepper]

They do but it isn't really easy to find. What part or model no. is your Shin Etsu. Most are here: http://www.microsi.com/packaging/thermal_mgt.htm but some are at another site. Some Coolermaster packaged TIMs are from S-E so you might find some instructions there as well.

.bh.

 

[idiotekniQues]

i have this version:

http://www.crazypc.com/products/50118.html

 

[idiotekniQues]

the instructions on their website are terrible.

under application it is unclear about whether the whole tube should be used.

"

Shin-Etsu MicroSi can provide X-23-7772-4 in 30 cc to 6.0oz cartridges. The cartridge delivery system can be utilized with automated equipment to minimize waste and provide an accurate dispense weight. The cartridge delivery system allows dispensing of the material, while protecting the integrity and exposure level of the unused portion."

it seems to imply there may be an unused portion, but it talks about such different amounts that they sell it in that who knows what they mean about the 1 gram dispensing syringes like the one i bought.

any users here have suggestions?

 

[Zepper]

I see no application instructions at the link above but there is an information request form there and a link to a data sheet for your product. There is a concept of applying HS goop. Apply the thinnest, evenest layer possible that will fill all the gaps. SE stuff isn't known as the easiest to apply but it works very well once applied. Up to you from here. Use the search engines too. Since your reseller charges you ten bucks a gram for it they had better be supplying application instructions and a data sheet and give you a kiss on the butt for good measure...

This link wasn't hard at all to find: http://www.xtremesystems.org/forums/archive/index.php/t-16521.html Duuuh...

Coolermaster supplies a reusable template with theirs to make application easy. Sounds like S-E is still a PITA to apply. I recommend heating up your heatsink to around 120 deg F in the oven to help keep the stuff workable. Put warmed compound on a cold HS and it'll harden up in a hurry.

.bh.

 

[Diogenes2]

Originally posted by: idiotekniQues
any users here have suggestions?

What others have said..

Just a pea ( small pea ) size dab in the middle of the IHS .

Press the HSF on .

Twist a little ..

Lock it down ..

 

[hydro1234]

Originally posted by: nataku00
I usually put a small dab in the center of the cpu's heat spreader, wrap some plastic saran wrap around a finger and smooth it out as thin as I can get, then install the hsf on top of it.

I do the same thing. I've tried the method where you put a dab on and just push down and twist a little, but I've always had significantly better results spreading it. I think the trouble I have is bringing the heatsink straight down on to the chip.

 

[mercanucaribe]

I've always spread a thin layer on both the heatsink and the spreader with a ziploc bag, and it's always worked fine. With the blob method you either don't get complete coverage, or you get some squeezed out, which is bad when the thermal paste is conductive.

 

[aigomorla]

okey, there are a FEW TIMS, that have unique application methods. But most of them is generic.

For a CPU, im guessing, on a C2D, it has shown to apply a thin line down the middle of the CPU. You need to line orientation of your core. IE. if the mobo is mounted normally, then a vertical line is drawn. This allows a more even blot to settle around the core area.

Now for a AMD its different. Since the DIE is located close to the center, you just want a rice grain blop in the middle and then clamp your heatsink on.

Both ways are simple. :] Remember if your using MX-1 or Shin Etsu, these require a different mounting style.



From my experience, i use Shin Etsu. Its the best, but has a really funky and annoying application method. You put he paste on the Heat sink instead of the cpu. Now do you guys understand why the freezer7 was pwning so well? the MX-1 was applied correctly.

You basically want to draw a Box or rectangle with tape. Then blop the Shin or MX-1 on the middle. Then with a credit card you need to flatten the paste into the sink. The more pressure you apply the better because you want to get rid of the bubbles. Then scrap the excess TIM off. Remember the tape will cause the credit card to leave a GAP, so you get an almost even distribution on the sink.

Then you Mount the block with the TIM applied. This is the best and most consistant application for MX-1 and Shin Etsu ive seen.

Also incase your wondering, MX-1 is a renamed Shin Etsu.

 

[graysky]

Here's a pic of the before the HS went on top of it using the thin line method. Worked pretty well, it's about 22-23 C in the room and after about 1-1/2 h of x264 cranking, the temps reported by TAT were all under the 65C threshold many consider to be "normal" for this chip (numbers were 60, 61, 55, and 55).

pic is here

I will say that it took some trial and error marrying the HS to the chip. There are really 4 different possibilities: two up-and-down, and two side-to-side (North/South and East/West and you can flip the HS 180 degrees since it's symmetrical.) I found that with my particular copy of the 120-Ultra Extreme and my CPU, neither of the N/S arrangements gave me temps like this.

 

[WoodButcher]

Originally posted by: graysky
Here's a pic of the before the HS went on top of it using the thin line method. Worked pretty well, it's about 22-23 C in the room and after about 1-1/2 h of x264 cranking, the temps reported by TAT were all under the 65C threshold many consider to be "normal" for this chip (numbers were 60, 61, 55, and 55).

pic is here

I will say that it took some trial and error marrying the HS to the chip. There are really 4 different possibilities: two up-and-down, and two side-to-side (North/South and East/West and you can flip the HS 180 degrees since it's symmetrical.) I found that with my particular copy of the 120-Ultra Extreme and my CPU, neither of the N/S arrangements gave me temps like this.

I was under the impression that the line was to be vertical on the chip, Am I mistaken?

 

[yh125d]

I used to do a small dot on my old a64's, now i use the line down the middle with my c2d. when i had to remount the hsf, i was greeted with good, even spreadage

 

[graysky]

Originally posted by: WoodButcher
I was under the impression that the line was to be vertical on the chip, Am I mistaken?

It depends on your chip, if it's a duo then yes, if it's a quad, then no. See the original link at AS5's site for more.

 

[WoodButcher]

Originally posted by: graysky

Originally posted by: WoodButcher
I was under the impression that the line was to be vertical on the chip, Am I mistaken?

It depends on your chip, if it's a duo then yes, if it's a quad, then no. See the original link at AS5's site for more.

Ahaahhhh, I see said the blind man.... as he pissed on his dogs' head,,,,

 

[Henny]

Pea sized??? That seems like way too much. I tought the AS5 website said the amount should be about 1/2 the size of a grain of rice.

 

[pelikan]

The reason for putting a dab in the center for a single core chip or a thin line for dual core, rather than spreading it out, is to avoid air pockets.

 

[Howard]

Originally posted by: pelikan
The reason for putting a dab in the center for a single core chip or a thin line for dual core, rather than spreading it out, is to avoid air pockets.

Yes. Also, you can't fvck it up.

 

[graysky]

So here is a shot of my q6600 installed in the MB with AS5 right before I added the HS. It shows the right amount in my opinion given a lapped HS and CPU (which is a thicker line than I used before); the red triangle I drew shows where that tag is on the CPU, remember that on quad core chips, the dies are placed in a different located relative to a dual core, see the instructions on AS5's website for more):

Pic

I generated the temps in the far right box with that line of AS5 about 18 h after I installed the HS. I will say that the temps were higher before I let the full load go for a while, so there really is something to this concept of 'break-in' with AS5 at least.

Pic