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And I thought heatspreaders on DDR2 DIMMs were for show...

uh, those are fbdimms. by definition they produce mucho heat.

they only have much sinking due to airflow issues I imagine.
anyways, with those sinks they cannot be used in typical boards (unsurprising, as it is apple we're talking about).
 
Heatspreaders v. real heatsinks. And I question the need for heatsinks on the RAM chips, as it is the AMB chip that really gets hot, or at least the earlier revisions did. AFAIK, the RAM chips/devices are just straight-forward 72-bit ECC devices that could be used on non-buffered ECC DIMMS.
 
Those are fully buffered ecc dimms that are neither physically nor electrically compatible with ordinary dimm slots, and they need heatsinks because they all have an active memory buffer chip on them. Not at all the same as the austentatious ddr3 heatspreaders from corsair, gskill, et al.
 
I have a box full of FB-DIMM that are not quite that thick but look similar. For the longest time I ran a server with those as a test box. I upgraded later and realized that the test box had 1000watt psus, the new server 370watt psus but out performed the old one in all ways.... The FB-DIMM sockets / riser had its own fan and you could just feel the heat roll of those things.
 
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