The only roadmap affected is the FinFET roadmap from:
GlobalFoundries Press Release, Aug 27th 2018.
"GF is realigning its leading-edge
FinFET roadmap to serve the next wave of clients that will adopt the technology in the coming years. The company will shift development resources to make its 14/12nm
FinFET platform more relevant to these clients, delivering a range of innovative IP and features including RF, embedded memory, low power and more. To support this transition, GF is putting its 7nm
FinFET program on hold indefinitely and restructuring its research and development teams to support its enhanced portfolio initiatives. This will require a workforce reduction, however a significant number of top technologists will be redeployed on 14/12nm
FinFET derivatives and other differentiated offerings."
"GF is intensifying investment in areas where it has clear differentiation and adds true value for clients, with an emphasis on delivering feature-rich offerings across its portfolio. This includes continued focus on its FDXTM platform, leading RF offerings (including RF SOI and high-performance SiGe), analog/mixed signal, and other technologies designed for a growing number of applications that require low power, real-time connectivity, and on-board intelligence."
From the Report to EU Parliament, mid-2017:
"The results for this project are a technical success for supporting Soitec FDSOI business. In this project the SOI substrate technology blocks for 22FDX technology and 22FD+ were developed."
"A number of activities (outside the project) will transfer the pilot line to full size production facility: with 1st industrialization phase started in July 2017 in Soitec to catch 22FDX ramp. Due to the successes in this project significant investment was done in 2017 in the 300mm Bernin FDSOI fabrication line. This first investment phase is will be followed in 2018 with a second phase."
22FD+ became 22FDX+ as in this image:
https://i.imgur.com/KOYu5AD.png
and I have previously talked about the Bernin II phases before in #283.
For 12FDX it was a spiral...
2016-
"Customer product tape-outs are expected to begin in the first half of 2019."
2017-
"The foundry is scheduled to move the 12FDX to risk production in the second half of 2018 followed by volume production in first-half 2019."
Which is verified in September 2017:
https://forums.anandtech.com/thread...nce-applications.2519335/page-4#post-39089092
0.5PDK is risk production for GlobalFoundries.
1Q 2018: "We expect to be taking risk production on the parts early next year (2019), so we are pretty far along with the technology." -
https://www.anandtech.com/show/1243...ew-with-dr-gary-patton-cto-of-globalfoundries
2Q 2018: "We expect tape outs on 12FDX in 2020 with deliveries in 2021." -
http://www.eenewsanalog.com/news/globalfoundries-add-another-nvm-fdsoi/page/0/1
2H2018 - NostaQuess:
12FDX is being pushed further along to support 22FDX+. Which hopefully it will get inserted into the roadmap eventually.
22FDX (Power-optimized)
22FDX+ (Performance-optimized)
12FDX (Perf or Power-optimized separated in PDK extensions, not in node).
Also, Europe and China are throwing billions at GlobalFoundries. United States is giving zip, Saxony is thousands-millions, not even close to billions. Dresden/Chengdu are both declared foundries for FDSOI. So, Malta barely makes revenue targets and is a constant loss. Malta is a declared FinFET foundry, even though they do lab-work for 22FDX/22FDX+/12FDX. So, if FDSOI comes out specifically a net profit transistor type. Then, all the expenditures will revolve around the leading edge in FDSOI.
The only people who can steal customers from GlobalFoundries are: HLMC, Samsung, STMicroelectronics.
Samsung with two low-capacity FDSOI fabs => S1(Korea) & S2(America)
HLMC with one low-capacity FDSOI fab => H6(China)
STMicroelectronics with one low-capacity FDSOI fab but are now licensing from GlobalFoundries => France and Italy fabs are not competing.
GlobalFoundries will have two fabs: Fab 11(China-MegaFab) and Fab 1(Europe-GigaFab).
While, for FinFETs it will always be go TSMC. TSMC will probably provide better differentiated options for 16FF/12FF/10FF over GloFo's 14FF/12FF.
Hypothetically: If Apple lets say created an B-series on FDSOI, which is would be a budget form of the A-series. Only GlobalFoundries would be able to satisfy their order capacity of FDSOI.