Yotsugi
Golden Member
- Oct 16, 2017
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It all depends on the chassis.Pretty sure KBL-R still has the upper hand quite easily when it comes to CPU performance.
Are you new to mobile SKUs or what?
It all depends on the chassis.Pretty sure KBL-R still has the upper hand quite easily when it comes to CPU performance.
Mikk you were like 200-300% way off for the tdp. Marketing, throtling what not it doesnt really matter much.This is a cherry picked benchmark and we have to wait for some 2700U benchmarks from a neutral source based on a production notebook. Take time to think about.
https://www.computerbase.de/bildstrecke/80377/7/
In this slide Cinebench runs way slower on 2700U. AMD isn't trustable when it comes to such marketing slides.
Mikk you were like 200-300% way off for the tdp. Marketing, throtling what not it doesnt really matter much.
Its just flat out beat the crap out of the competing product and its a surprise its that low tdp and the reason is the new power tech employed. Next to nobody expected that. Let it rest. Be happy.
The Swift 3 is a little different than the others – we were told that Acer has built this chassis to dissipate 25W of processor power rather than 15W, meaning that Acer is going to be taking advantage of longer turbo modes and better performance numbers than other Ryzen Mobile parts.
RR die has no HBM PHY.I hope a version with an HBM cache is in the cards for the future.
Regarding that in a slide released back when Ryzen was launched:
I guess I missed the day that 15w became the standard mobile power level.
Could be. Thought it was still roughly 35w.More or less its been this way since Haswell.
The transition started slowly in Sandy, but from Sandy to Ivy to Haswell to the almost non existent Broadwell followed quickly by Skylake and Kabylake, it has been a gradual change with more and more skus being in the sub 20 watt range of 15 to 18w.
Point was there were three Ryzen Mobile designators from the beginning with U being of a middle TDP rating, most of us just were wrong to think it it's for 25-35W and M for 15W. U being for 6-25W makes it interesting to see what M will be used for (2c4t Banded Kestrel alike silicon still coming?).I guess I missed the day that 15w became the standard mobile power level.
RR die has no HBM PHY.
And why would you waste HBM2 on 704SP chip?
I don't think you should be too confident on the first point. The obvious memory controller area in Raven Ridge looks decently different from Summit Ridge and we don't have a real die shot of Vega - at least to the best of my knowledge, to use as a reference. I'll admit that it's unlikely and there doesn't appear to be any smoking gun on the die shot, but I also wouldn't say with 100% certainty that there is no HBM2 PHY tucked in there somewhere.
That was my point people I am not sure by the slide that it was apparent that these were going to be 15w chips and on top of that have these kind of clocks for 4 cores.Point was there were three Ryzen Mobile designators from the beginning with U being of a middle TDP rating, most of us just were wrong to think it it's for 25-35W and M for 15W. U being for 6-25W makes it interesting to see what M will be used for (2c4t Banded Kestrel alike silicon still coming?).
Agreed as cool as a HBM chip would be a a SoC, there is only one design win worth the development cost. Honestly its probably several generations before it's really worth it in packaging, cost, and performance.People need to stop fantasizing about HBM on an APU anytime soon. A mainstream part like this doesn't justify HBM from a cost or performance perspective.
Imagine, what product would AMD have if they would just slap there Interposer and HBM2 on the die package.
About Raven Ridge chips, available, It is actually quite huge surprise with the TDP, of this product. Nobody expected this.
Perhaps the next iteration of DDR would make integrated-GPU gaming viable: 2 channels, 4.8 GT/s, 76.8 GB/s, reducing need for HBM.
It may also be possible that there's a GDDR5 controller in there somewhere. The only thing holding back Raven Ridge from >= PS4 gaming performance is bandwidth.
At what TDP? at the 15watt 2700u its no contest because the i7 + MX150 cant run that low. At 25watt its still going to be the 2700u. At 50watt TDP its prob the i7 + MX150 but that is a completely different class of laptop.How would this Zen APU compare to a Intel i7 with MX150 graphics in real world gaming @ 1080p?
I guess the problem is the Intel has integrated graphics on the cpu eating up power and a MX 150 for gaming @ 1080p. Or is the power usage for the Intel gpu disabled while gaming with the Mx150?At what TDP? at the 15watt 2700u its no contest because the i7 + MX150 cant run that low. At 25watt its still going to be the 2700u. At 50watt TDP its prob the i7 + MX150 but that is a completely different class of laptop.
They literally spent like three slides explaining new and shiny power management to you. It's actually really awesome.How does the APU's TDP work?
If course it does, down to cTDP levels.Does it throttle while gaming?
A little bit. Vega is much more effective as using bandwidth, courtesy of DSBR.Does it choke @ 1080p due to bandwidth limitations?
That's not the problem, iGPU power is near zero while the dGPU is active. The difference is the sum of chip TDP: 15W for i7 + 25W for MX 150 results in a total platform power consumption of about 60W. By contrast a platform with 15W TDP CPU and no dGPU will use around 25-30W, around half the power.I guess the problem is the Intel has integrated graphics on the cpu eating up power and a MX 150 for gaming @ 1080p. Or is the power usage for the Intel gpu disabled while gaming with the Mx150?
How many OEMs do actually bother with LPDDR3/4 in the laptops besides Apple?Forget HBM..I think it's more disapointing lpddr4 isnt supported.
This would be far more realistic and have huge advantages that outweigh the inabilty to upgrade.
In the end, the only thing that counts is performance, and, as we have seen in the past, AMD's partners are just not going to have a product out there that fully takes advantage of what AMD brought to the table.Imagine, what product would AMD have if they would just slap there Interposer and HBM2 on the die package.
About Raven Ridge chips, available, It is actually quite huge surprise with the TDP, of this product. Nobody expected this.