• We’re currently investigating an issue related to the forum theme and styling that is impacting page layout and visual formatting. The problem has been identified, and we are actively working on a resolution. There is no impact to user data or functionality, this is strictly a front-end display issue. We’ll post an update once the fix has been deployed. Thanks for your patience while we get this sorted.

A64 runs just as hot on AS5 than the normal stuff

O

otispunkmeyer

Lifer
refitted my Zalman CNPS7000Cu with AS5, put a thin layer on.

yet it still idles and loads at the same temps as it did with zalmans own generic white stuff.

did i do something wrong?
 
did you cleaned the HSF and the cpu it properly before giving it a new paste? does the case have enough ventilation? how "thin" is your paste layered on the cpu ? is it at least 1-2 grain rice size for the AS5 ?
 
Originally posted by: Powermoloch
did you cleaned it properly before giving it a new paste? does the case have enough ventilation? how "thin" is your paste layered on the cpu ? is it at least 1-2 grain rice size for the AS5 ?
Click to expand...


yes i used a TIM cleaner from Akasa to clean the cpu and sole of the HSF so they were like new.

having jus posted that it has just dropped 3 degrees lol, might be a dodgy sensor.

yeah it was pretty thin, i put a blob on and with a old credit card spread it round. it was so thin it didnt actually cover the whole cpu heat spreader. so i put tiny amounts in the uncovered areas and then worked them in.
 
That should be more than enough time. IIRC, proper cure time is ~200 hours of off and on use.
 
Like the previous poster stated, you need to take your cpu to full-load/temps, and shut it off about 20 times until the silver particles align for best heat transfer. Even after doing all this, you should only see about 1-3 degrees celcius difference.
 
hmmm, ill see how it goes.....i may be in for a upgrade soon anyway thats going to require me to pretty much change everything ... damn skt 754!

i mite be going SLI, which means new mobo, which means new cpu, which means new PSU, and while im at it, mite as well get new ram! lol
 
Originally posted by: Andres3605
i put a blob on and with a old credit card spread it round.
Click to expand...

I think you are not supposed to spread it, just put the AS5 and install the HSF
Click to expand...

hmm, there were no instructions, i just followed what i did with the zalman stuff. it makes sense to ensure full even coverage though
 
AS5 Instructions
"Since the vast majority of the heat from the core travels directly through the heat spreader, it is more important to have a good interface directly above the actual CPU core than it is to have the heat spreader covered with compound from corner to corner."
 
Originally posted by: Andres3605
AS5 Instructions
"Since the vast majority of the heat from the core travels directly through the heat spreader, it is more important to have a good interface directly above the actual CPU core than it is to have the heat spreader covered with compound from corner to corner."
Click to expand...


but if i got a good layer in the middle, it shouldnt matter whats on the outer edge? hmmm thanks for the link, reading now. ill sort this when i take my rig apart for the upgrade. cheers!
 
Never use any oil or petroleum based cleaners (WD-40, oil based grease removers and many automotive degreasers) on the base of a heatsink. If you use a citrus based cleaner, you must use ArctiClean 2 Thermal Surface Purifier to remove the citrus oil before applying new thermal material, Any oil remaining on the heatsink will fill in the microscopic valleys in the metal and significantly reduce the effectiveness of any subsequently applied thermal compound.

ahhh now the Akasa TIM clean is citrus based. and contains petroleum distilates. i did wipe down the HSF with water and then a dry cloth after using this stuff, but this could be the issue.

 
Originally posted by: otispunkmeyer
Originally posted by: Andres3605
AS5 Instructions
"Since the vast majority of the heat from the core travels directly through the heat spreader, it is more important to have a good interface directly above the actual CPU core than it is to have the heat spreader covered with compound from corner to corner."
Click to expand...


but if i got a good layer in the middle, it shouldnt matter whats on the outer edge? hmmm thanks for the link, reading now. ill sort this when i take my rig apart for the upgrade. cheers!
Click to expand...

The reason for placing the blob in the center and letting it spread naturally is so that you do not get trapped air as you can with the 'pre-spreading' method. Air will be pushed out through the open edges and the center will be a nice continuous layer. Also the clamping pressures used for modern heatsinks are higher than when people were initially using specialized thermal pastes. At the time pre-spreading was necessary to avoid a layer too thick, but now that clamping pressures are higher, a pretty thin layer just 'happens'.

When pre-spreading, you can seal off the area around an air bubble and trap it between the HS and CPU. If you end up with such a bubble over the center of the die, then you are worse off than if such a bubble were somewhere else. The application can be fine, but it is more 'hit or miss' than the method now recommended.

As for cleaning, I generally just use denatured alcohol. It evaporates well and leaves no residue.

All told though, the layer is very thin and the filling of tiny gaps is the primary improvement. You will barely see a difference going to AS5 over alumina paste, even if the application is perfect.
 
You must log in or register to reply here.

TRENDING THREADS

Back
Top