If you overclock any board of the last few gens so that the processor's package power exceeds the default limit based on spec TDP, it will throttle with certain settings enabled. So if your LinX or Prime95 are showing a wattage that exceeds, say, 95W, if that's the default limit, you'd simply increase it.
There were also some other features connected to thermal monitoring and thermal control. If you were overclocking and you got the temperatures to the default limit for "enabled," it would also throttle - that was the idea of having that BIOS feature. You take your chances, but the board maker's BIOS footnote suggested "turning it off' for overclocking.
As far as I know, that was standard advice for my gen2/gen3 boards. Of those features -- I think the pertinent one was "long endurance power limit." But in stressing with an overclock, you're going to increase the thermal wattage beyond spec -- 10, 20, maybe 30 watts. Suppose I pushed my Sandy Bridge to 140W -- the same as the spec for an SB i7-3960X or whatever the hexa-core "E" processor was called. That's where you'd want to increase that value.
Anyway, my board is a Sabertooth Z170 S -- no different than the Mark 1 but for lacking the duct-plate. And those power management factors would only come into play with higher clocks, default settings. What defaults they throw could either be the spec TDP or a value based on the spec -- plus some margin. You'd never discover it if your stress-test of choice was either XTU or Aida.
But it's always had mention in the various web-site OC guides I'd seen, whatever their reliability.
With the GA Z170 HD3 motherboard it will not throttle, when increaseing the Vcore as far as 1.45v, The board just limits the voltage output. I can see the limiting voltage with HWmonitor, also the output voltage is well above safe limitis. That is what motherboard manfacures do is limit the voltage output, since sandy Bridge.
The
thermal design power (
TDP), sometimes called
thermal design point, is the maximum amount of
heat generated by a computer chip or component (often the
CPU or
GPU) that the
cooling system in a computer is designed to
dissipate in typical operation. Rather than specifying CPU's real
power dissipation, TDP serves as the
nominal value for designing CPU cooling systems.
[1]
The TDP is typically not the largest amount of heat the CPU could ever generate (
peak power), such as by running a
power virus, but rather the maximum amount of heat that it would generate when running "real
applications." This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).
[2]
Some sources state that the peak power for a microprocessor is usually 1.5 times the TDP rating.
[3] However, the TDP is a conventional figure while its measurement methodology has been the subject of controversy. In particular, until around 2006
AMD used to report the maximum power draw of its processors as TDP, but
Intel changed this practice with the introduction of its
Conroe family of processors.
[4]
A similar but more recent controversy has involved the power TDP measurements of some
Ivy Bridge Y-series processors, with which Intel has introduced a new metric called
scenario design power (SDP).
[5][6]https://en.wikipedia.org/wiki/Thermal_design_power