AMD has already made their point abundantly clear. They won’t go 4+. The demo had 72mb and prod skus will have 192 (probably across 2 chiplets)
Uh, I didn’t even say what you assumed I said 🙄Bold of you to assume it will be present at all on single CCD parts. Remember, it is more expensive to make these chips. Margins are higher on the 5900X and 5950x.
Pretty sure the demo had 192 MB which is 1 stack hi on 2 chiplets.
At the risk of misrepresenting another's argument, I understand the belief to be that AMD is sandbagging when they say the SKUs have 192 MB of cache and that if after ADL launches, ADL beats Zen 3 by enough in gaming, AMD will throw however many stacks they need to take back the lead instead of the 1 stack SKUs they keep mentioning.
Pretty sure the demo had 192 MB which is 1 stack hi on 2 chiplets.
At the risk of misrepresenting another's argument, I understand the belief to be that AMD is sandbagging when they say the SKUs have 192 MB of cache and that if after ADL launches, ADL beats Zen 3 by enough in gaming, AMD will throw however many stacks they need to take back the lead instead of the 1 stack SKUs they keep mentioning.
Anyone that thinks Zen 3 will beat Alder Lake in anything needs to go to AT bench, pick a ST benchmark of the 11900k, and add 15-20% to it, and see which number (Zen 3 or the new number) is higher. Hint: Alder Lake will be in most scenarios.
AMD has already made their point abundantly clear. They won’t go 4+. The demo had 72mb and prod skus will have 192 (probably across 2 chiplets)
Read the hot chips presentation slides and get back to us. What I stated was fact, not an educated guess nor wishful thinking. One thing we can absolutely certain of is factual information in AMD presentations, for better or for worse.
Anyone that thinks Zen 3 will beat Alder Lake in anything needs to go to AT bench, pick a ST benchmark of the 11900k, and add 15-20% to it, and see which number (Zen 3 or the new number) is higher. Hint: Alder Lake will be in most scenarios.
Really? I must have missed that part.
As secretive as AMD is about everything, to the point of describing last years parts at conferences, not upcoming ones, why do you think AMD spilled everything about their V-Cache at the demo, left nothing for the launch?
This is the slide I saw from their Hotchips presentation. Is there a different one I'm supposed to be looking for?
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I thought I saw it on the liveblog. I will see if I can find it.
I agree. The numbers will likely be all over the place, but the gaming SKU Intel is launching Alder Lake with, 12900k will be convincingly higher than 11900K and Zen 3.
This Geegbench score analyzed by VideoCardz looks strong.
Intel Core i7-12700 non-K Alder Lake CPU is almost as fast as Ryzen 7 5800X in leaked Geekbench score - VideoCardz.com
The FP and INT scores are not that strong vs the 5800X. Looking at some averages INT may be around 10% faster for this 12700 vs 5800X but FP is looking about the same give or take.
If I had to guess I would say that in reviews where they test 1080p max the performance difference between the 12900K and the 5900X in gaming will be pretty small, probably sub 5%.
The low res and low settings tests that Ian does will be more interesting to spot differences and here it might draw level with the 5900X/5800X. Looking at those tests ADL needs to improve by 20% + in some games to match Zen 3 at the more CPU limited settings and at more GPU limited settings your CPU does not matter as much.
If I may, you're probably getting confused from this post where @Asterox posted a video from the original Zen 3 launch where they mentioned 72 MB of "game cache" (just o.g. Zen 3 L3 + L2 max combined total) and in the same post, included a picture of the Zen3d gaming benchmarks from AMD. I believe the intent was to show how the "3D V-cache" was an extension of AMD's original "game cache" marketing, but the "3D V-cache" prototype was clearly 192 MB L3 (32 MB bases + 64 MB stack per CCD) from their Hot Chips presentation.
I dunno, I still believe it'll be 6000 series. Rembrandt will be included in that.
Compared to previous generations only half of the stack has been released for the 5000 series. It makes far more sense for a single one off product with a weird name like "5000 XT" than making an entire new series which will probably have even fewer products in it.
Releasing a 6000 series makes everyone think your 5000 series is obsolete. No need to Osborne your own product line just for the sake a small number of high-end CPUs most people can't afford that AMD will have even more problems supplying.
Just like releasing the 4000 series made the 3000 series obsolete. AMD will increase the number as it wants, there's no logic required to it.Releasing a 6000 series makes everyone think your 5000 series is obsolete.
Just like releasing the 4000 series made the 3000 series obsolete. AMD will increase the number as it wants, there's no logic required to it.
MILAN-X seems to be already ready ?
So first MILAN-X and then VERMEER-X ?
Remember, it's possible that AMD will still use die harvesting on lower end parts. They'll know that a given 5600x has disabled cores before the bonding process, and they'll know that some SRAM cells will be bad in some SRAM die before bonding. They could choose to bond 48MB or 32MB SRAM dies to 5600X dies to make 5600x parts with a total of 64 or 72 MB of L3.
However, I don't expect AMD to produce a 5600X3D
Probably not ready, just that they are starting final production. If Zen 3D was going to launch at CES you'd need to start pretty soon.
Unless this is the new "B2" stepping that needs the entire fabrication process from start, no, if it is just standard Zen 3 die, turning it into Zen 3D, the lead time is limited.
~2 weeks? Certainly not 2 full quarters.