My recollection of Lisa Su's statement is that they will be "ready to start production
by the end of this year", and considering the context was her V-Cache announcement, my understanding is that the determining factor for the schedule is the underlying hybrid bonding technology, which is a packaging technology. The CCD chiplet has been in volume production for a while now, and there is no reason to think the V-Cache chiplet is not ready to go as well, as these are made on the same tried and tested process node.
This understanding also correlates with TSMC's roadmap for their SoIC hybrid bonding technology. From this viewpoint, what is likely to determine AMD's schedule is the ramping of the packaging capacity, as hybrid bonding requires cleanroom level of cleanliness and precision, which is beyond what the traditional packaging (OSAT) companies are capable of. AMD depends on TSMC here.
So, I think it is pessimistic to interpret Lisa Su's statement to mean the full three months chip production time from wafer start to chip delivery, starting from the very end of the year. It is more likely that the chiplets are ready to go, with the packaging capacity coming online in the coming quarters, in line with TSMC's execution of their packaging roadmap. In short, if all goes well, we may see product announcement
and launch before the end of the year.
Obviously, it would be highly advantageous for AMD to have products ready with V-Cache around the time Intel launches Alder Lake. Having V-Cache offered on the upcoming Threadripper generation would also be highly desirable. It will be interesting to see how the schedules pan out.