https://www.tomshardware.com/tech-industry/pat-gelsinger-has-advice-for-lip-bu-tan-as-he-settles-into-one-of-the-hardest-jobs-available
Well, that's about it.
The Lehman shock broke the world in 2008, however, financial industry enjoyed virtual no punishment...
Many american investors hold shares of the TSM stock.
Frankly speaking, they are the latent enemies for Intel and expose the U.S. Security to danger, without realizing...
As if you knew nothing about intel's manufacturing pipeline, right?
i18A's test wafer is running at Arizona, namely Intel starts i18A HVM at Oregon.
Probably, by end of 3Q25, Intel starts i18A HVM at Arizona.
P.S.
In a word, Intel wins the race of GAA/BSPDN/sub-2nm process node.
Didn't you see MTL's tile?
PTL looks like a monolithic die.
It probably uses next gen Foveros (25um bump-pitch) or Foveros direct...
P.S.
CWF uses Foveros direct on Intel 3-T and looks like a monolithic die in compute tile.
https://wccftech.com/intel-showcases-panther-lake-socs-for-the-first-time-to-the-public/
This is beautiful tile design (c.f. MTL)...
Maybe Foveros is shrunk to 25um bump-pitch from 36um.
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