Recent content by ICD7

Well as far as heat sinks are concerned we are pretty close to the ambient air version to Moore's law. water may be the interim solution for overclocking. but billions are being spent to resolve this issue, some solutions on the exotic side...

One idea I like is the Stirling engine http://www.tweaktown.com/news/9051/msi_employs_stirling_engine_theory/index.html allot of people have been playing around with this for a hundred years and recently I think some breakthroughs on performance with solar applications. I would like to think...

Evidently the idea has been around for a while. http://en.wikipedia.org/wiki/Dymalloy And much researched Characterization of various metal matrix composite thermal management materials http://udini.proquest.com/view/characterization-of-various-metal-pqid:1863925311/ My guess is like the...

I think to make a heat pipe is not to hard - take a tube and coat the inside with a light oil & then apply a copper powder with large enough particles so it is porous. or use a screen or some metal wool heat it up to sinter the particles together. oil burns off clean the inside of both...

Silver is only 5% (?) better than copper. Heat pipes in of themselves are pretty damn good and transfer heat 100X - 200X that of diamond. The limitation of course ends up being the containment structure material like copper and the interface resistances of base and fins to the pipe. So...

I can not say as I have not really looked to hard at Heat Pipes nor done any in depth analysis on them. My thermal cascade comparison was kind of a mental averaging from some thermosyphon and water block tests a couple of years ago. In any event you only have about 6-7C margin in temp rise...

Very interesting post and I think marks a turning point on limits of performance. over the last 15 years I have watched HS performance improvements almost on a monthly basis Aluminum to copper to more airflow to heat pipes etc. The end product here 6/12 heat pipes, 2 120mm fans and is the size...

Just to go on record here and respond to post # 23 by DLeRium http://innovationcooling.com/image/icreport3.pdf PROCEDURE: FMS respects the Forensic Best Practice Guidelines as set out by the Scientific Working Group on Imaging Technology (“SWGIT”) and the Scientific Working Group on...

2 major failure points for thermal compound are Pump Out which occurs with thermal cycling, the expansion and contraction of the joint literally pumps liquid/compound out from between the mating surfaces. The other is Bake Out where a high heat load dries out the compound and leaves voids in...

From a reliability Survey we are doing Long Term reliability hinges on good contact and presssure additionally you need a high viscosity (Thick) compound, OEM's recommend +90% bulk loading for the simple reason it is harder to pump out a solid vs. a liquid hence the clay like consistancy

Assimilator1, Rudy Toody - good to see you guys still kicking. so application must be 4 going on 5 years since the thread started? I like the reliability feed back, good stuff. In any event this was pretty interesting- go to 4.08 min. on the video and freeze it...

I have been watching the thread with some interest, excellent! I think his testing is very accurate I can see from the paste impression that he has good contact as in the second test above full contact but a little light on pressure probably between 30 and 40 psi from the grease thickness but I...

We have been doing a IC Diamond Reliability Survey over at Notebook Review with some interesting results, although only halfway through the survey a major factor in long term reliability relates to Contact and Pressure as we went through the process here with C/P and performance same applies to...

I am not convinced on this one If that were true, Aluminum oxide the preferred abrasive for etching glass and is used in AS5,Shin Etsu, Mx-4 etc. would be causing wholesale slaughter of IHS serial numbers with an MOHS of 9 and similar particle sizes. Nothing is going to move if your sink is...

No problem with a bare die, IC Diamond is used extensively on bare die applications Notebooks, GPU's with no damage, I even have a gpu application with a contact pressure test of over 90 psi and no damage. While diamond is harder than most materials it is only incrementally so The metal oxides...