From Artic Silver.com:
"Our testing has shown that this method minimizes the possibility of air bubbles and voids in the thermal interface between the heat spreader and the heatsink. Since the vast majority of the heat from the core travels directly through the heat spreader, it is more important to have a good interface directly above the actual CPU core than it is to have the heat spreader covered with compound from corner to corner."
http://www.arcticsilver.com/images/p4_cmq_dab2.jpg
"The photo to the right shows how the pressure from the heatsink base spreads the compound and also shows a P4 with the heat spreader removed to show the location of the actual CPU core that is the source of the heat."
Would application of Ceramique be any different because the CPU is dual core?
"Our testing has shown that this method minimizes the possibility of air bubbles and voids in the thermal interface between the heat spreader and the heatsink. Since the vast majority of the heat from the core travels directly through the heat spreader, it is more important to have a good interface directly above the actual CPU core than it is to have the heat spreader covered with compound from corner to corner."
http://www.arcticsilver.com/images/p4_cmq_dab2.jpg
"The photo to the right shows how the pressure from the heatsink base spreads the compound and also shows a P4 with the heat spreader removed to show the location of the actual CPU core that is the source of the heat."
Would application of Ceramique be any different because the CPU is dual core?
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