won't care about Broadwell, will be too busy with Haswell-E
Skylake looking like the more enticing option to return to double dip with mainstream, DDR4 + PCIe4. Although I suppose DDR4 could be a problem, as unless they increase the memory controller from dual channel to triple or quad, that means we're going to be limited to 2 DIMMs...not that 99+% of mainstream rigs will
need more than 16GB that an 8GB pair (would assume to be relatively common by then) would provide, but I know its already a minor damper on X99 having "only" 4 slots for quad channel DDR4 after having up to 6 with X58 and then up to 8 with X78.
Indium solder will be making a comeback to mainstream, you reckon?
I was under the impression they got away from solder because they could, ie TDP was low enough, so unless Broadwell gets TDP up there (not sure how with a die shrink, outside of Intel going totally nuts on beefing up the iGPU) I'd think not? Although I suppose temps could also just start to get out of control at current stock clock speeds on the new process with the sub-par TIM paste to merit going back to solder despite TDP being low...