Oh, yeah, weren't you one of the guys that said copper was too expensive to use for heatsinks? 😉
Looking at the price of the solid copper heatsinks, their limited performance advantage - they're too expensive for me at least.
🙂
There are some sensibly engineered heatsinks, that use a copper heat spreader and aluminium fins - keeping down cost and weight in the process, while sacrificing little performance. In fact, many of the new high-performance coolers use this technique. There are few solid copper heatsinks, because they
are too expensive.
The key points I'm trying to make are that:
1) thin plating is not going to be good enough, whatever it is made of. Thermal resistance is directly proportional to the cross-sectional area.
2) Silver is not much better than copper: If you plated the fins with 1mm of silver, plating with 1.1mm of copper would be as effective.
3) The thermal flux in the fins is relatively low, you have to work hard to improve their performance. By adding or improving the the heatspreader you get far more bang for the buck.
I suspect though, that as CPUs become smaller and their heat output increases, that there will come a time, when exotic techniques will be needed to the spread heat. Be that, a silver slug with embedded heat pipes, or something else. Diamond (the best thermal conductor available) has been used in the past as a heat spreader in very high performance chips (mainly military). Due to its cost, it's unlikely to be a practical proposition for mainstream (or even enthusiast devices).