Will Conroe BE Picky?

[Luckyboy1]

Ok, so the new Conroe deal is going to be the next sliced bread or at least until we hear back from AMD, which I expect. However, has anyone considered what that thin wafer design will do to power and cooling needs?

 

[biostud]

uhm, yes it has been considered, and the good thing about conroe is that it's going to use a lot less power than P4 and therefor not run as hot.

 

[SlitheryDee]

All I can base my judgement on are intel's claims, yonah's power requirements, and assumptions I've made based on the 65nm process' effect on netburst. Accounting for all that it seems that Conroe's more efficient architecture (based on what I know about yonah), coupled with the smaller manufacturing process would make Conroe very easy to power and cool. It is reasonable to assume that both power requirements and heat dissipation will be higher than yonah given the architectural overhaul separating the two.

I'm not sure that this is exactly what you're asking though. What do you mean by "thin wafer design"? Is this a new fabrication technology (apart from the 65nm process) that I somehow missed?

 

[JEDIYoda]

Originally posted by: SlitheryDee
All I can base my judgement on are intel's claims, yonah's power requirements, and assumptions I've made based on the 65nm process' effect on netburst. Accounting for all that it seems that Conroe's more efficient architecture (based on what I know about yonah), coupled with the smaller manufacturing process would make Conroe very easy to power and cool. It is reasonable to assume that both power requirements and heat dissipation will be higher than yonah given the architectural overhaul separating the two.

I'm not sure that this is exactly what you're asking though. What do you mean by "thin wafer design"? Is this a new fabrication technology (apart from the 65nm process) that I somehow missed?

so fo you even understand what you just said......lolo...

 

[JSFLY]

Originally posted by: JEDIYoda

Originally posted by: SlitheryDee
All I can base my judgement on are intel's claims, yonah's power requirements, and assumptions I've made based on the 65nm process' effect on netburst. Accounting for all that it seems that Conroe's more efficient architecture (based on what I know about yonah), coupled with the smaller manufacturing process would make Conroe very easy to power and cool. It is reasonable to assume that both power requirements and heat dissipation will be higher than yonah given the architectural overhaul separating the two.

I'm not sure that this is exactly what you're asking though. What do you mean by "thin wafer design"? Is this a new fabrication technology (apart from the 65nm process) that I somehow missed?

so fo you even understand what you just said......lolo...

Nerdspeak: Hes basically saying yes its gonna be easy to power and easy to cool.

 

[SlitheryDee]

Originally posted by: JEDIYoda

Originally posted by: SlitheryDee
All I can base my judgement on are intel's claims, yonah's power requirements, and assumptions I've made based on the 65nm process' effect on netburst. Accounting for all that it seems that Conroe's more efficient architecture (based on what I know about yonah), coupled with the smaller manufacturing process would make Conroe very easy to power and cool. It is reasonable to assume that both power requirements and heat dissipation will be higher than yonah given the architectural overhaul separating the two.

I'm not sure that this is exactly what you're asking though. What do you mean by "thin wafer design"? Is this a new fabrication technology (apart from the 65nm process) that I somehow missed?

so fo you even understand what you just said......lolo...

Most of it I guess 🙂

I meant that I haven't heard the term "thin wafer design" in relation to intel's new manufacturing process or upcoming processors.

I don't claim to be a guru of any sort. My assertions are based on what I've read from various sources, discussions that I've taken part in on these forums, and my own personal experience which is naturally limited. (but that doesn't make me different from most of the rest of us in this case).

If I've made any obvious errors or if my post contains some discrepancies it would be a great service to me if you pointed them out. After all I originally joined this forum to learn new things. 😉

 

[Luckyboy1]

discrepancies?....

I dunnow about that! I can tell you that they are going from what was at the thinnest, a .90 process to a .65 process which is about as thin as many system RAM wafers. I've been told by several RAM maker reps that it is because of the thin wafer that the system RAM is much more sensitive to heat than the CPU.

Now, if the CPU maker adopts a process that has benefits due to the thin wafer, like lower power consumption and less heat as a result, on the face of it, that looks good. Ok, then why in the same article do they give us a gander at Intel's ideas on water cooling? The thin wafer along with the water cooling being thrown out there at the same time gets me wondering... maybe about nothing, but I've always been suspicious of all that gain with no pain.

 

[biostud]

Conroe seems to be taking the best from technology from P4 and mixing it with the best from Pentium M/Yonah, supposedly giving a very fast and efficient processor in all aspects, except maybe from large clusters.