Intel 22nm to 14nm has 2x transistor density.
GloFo 28nm to 20nm has 2x transistor density.
GloFo/Samsung 14nm FinFet +15% transistor density over 20nm.
GloFos 28nm is close to Intels 22nm in density, Intel has a small lead.
So at the end, both GloFos/Samsung (i will say TSMC also) and Intel 14nm processes will have almost the same density
Here are some real facts (14nm, for example, has more than 2x scaling):
Intel has a massive 35% density lead until FinFETs arrive in H1 2016. If 10nm doesn't have any problems, it will launch only a short time later, substantially increasing its density advantage. The competitor's 14nm FinFETs (marketing: 10nm) will just arrive 2+ years later, which will still have a lower density than even Intel 14nm, while Intel's already launching 7nm.
Anyway, you will now probably say that there will be FinFET Plus, but we don't know when those arrive, it might be a few months or a year, and they will partly narrow gap; to about 1.3x lower density.
and comparable electrical characteristics(Intel could probable have a small lead).
You think that the competition's first generation FinFETs, which might have been rushed somewhat since they don't 2 full nodes after HKMG, but just 1 node later, will easily compete against Intel second generation Tri-Gates?
That will only hold until Intel will launch its 10nm products sometime in 2017.
I don't think you have any substantial information that confirms a 2017 launch while Intel stated a 2015 ramp up of 10nm and 2017 for 7nm?
I believe AMD will have a chance in 2016 by using the 14nm FinFet process. If they will not, then there is no possible way to directly compete in CPU performance alone.
One more thing, even if they will not get the faster performing product, they could have a better Performance per Watt SKU by using the 14nm FinFet process.
I don't think the 14nm process will be any different than 28nm vs 22nm, at least not in AMD's advantage.