WHY DOESN'T AMD PUT A PENT4-STYLE HEAT SPREADER ON THE NEW ATHLONS??!?!

[dpopiz]

just what I said

 

[Killrose]

Is'nt that what the Heatsink does anyway? Besides, the new T-birds (Palomino/Athlon4) have overheat protection built in.

 

[Courtland]

Why do you have to post in all caps?
Sorry, I am usualy not one to flame, that is just annoying...

 

[Demon-Xanth]

Check out the K6-2 packaging


Check out the statements claiming the FCPGA package as the greatest thing since sliced bread. AMD was using FCPGA+heat spreader before they used straight FCPGA.

 

[dpopiz]

's ok I understand the flame, hehe...was just getting a little worked up there


anyway, Reasons I Think A Heatspreader Is A Good Idea:

- virtually impossible to damage the die
- much larger surface area = much better heat transfer
- Athlons are WAY too hot these days!

Don't get me wrong, I am actually normally completely biased against Intel, but Athlons are so hot now that I think I may possibly turn to the dark side (Intel) for the first time. I think a built-in heatspreader could help quite a bit.

 

[Courtland]

I am not familiar with this heatspreader stuff, but I can say that it would be nice if it wasn't so easy to chip an Athlon die, I never realized how fragile they are untill I did it to mine with a swiftech hsf, so much for its great mounting system, then again I cracked it taking the damn thing off, anyway, yes, athlons are running a bit too hot for comfort now, and I don't know how they are going to do in a year or so when everyones on the .13 micron, but heat wont be a big issue then I guess.

 

[BurntKooshie]

It's not much better heat transfer, really. You're adding an additional interface material - the fewer, the better.

 

[Mikewarrior2]

Demon-Xanth,

K6-2s are NOT FC_pga manufactured CPUs. They are older PPGA manufactured CPU's, and hte cpu core is embedded inside the ceramic PCB on the opposite side of the actual contact surface.


BurntKooshie,

A well made heat spreader does work well, because it increases contact surface tremendously and helps protect the core.



Mike

 

[Demon-Xanth]

FCPGA looking?

Edit: Even more naked K6 action!

 

[Colt45]

they ARE FC-PGA chips..

 

[Wingznut]

The FC in FCPGA stands for Flip Chip. It means that the die is turned over.

It's not just a style of cpu packaging without heat spreader.

 

[Mikewarrior2]

Then those are soley the newer K6-2s. Older k62s and 3s are PPGA chips.

FCPGA only became common late in 99. Prior to that, all socket-chips were PPGA(and k6-2s were probably still PPGA for a while after that).


Mike

 

[Swanny]

Mikewarrior2: Have you actually taken apart a K6-2 to look at it? All the ones I've seen have had the die on the top side of the PCB, making it "flip chip".

 

[Mikewarrior2]

yes, I have.... A march 99 chip. PPGA. No FLip-chip mounted cpu core.



Mike

 

[dpopiz]

calm down, guys!

It doesn't matter which of you is right.

 

[Boonesmi]

i dont think i would want amd to put a heat spreader on.

its not very difficult to keep from damaging the core when putting on a hsf. a little caution is all it takes. plus i wouldnt be able to read the core, i would have to pry it off to find out what stepping.

 

[Wingznut]

Well, the markings would be on the outside of the spreader. Just like a P4.

 

[DragonFire]

A better question to have asked is, Why doesnt AMD put a temp probe of some sort within there cpu.

 

[kmmatney]

I like the idea of a heat spreader, the ones on the K6-2 are great. Nice never having to worry about cracking the die.

 

[Blastman]

Here are some nice pictures of the Tualatin ? ? with an integrated heat spreader. It?s a beauty.

I think it?s a great idea but I?m sure it adds to the manufacturing cost.

 

[Swanny]

Ok, Mike, I yield to you All the ones I've taken apart have been with the slug on top.



<< A better question to have asked is, Why doesnt AMD put a temp probe of some sort within there cpu. >>



The new Palominoes have an internal diode.