- Jun 30, 2004
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I built my i7-6700K Skylake system around beginning of 2017. I likely need to replace the motherboard, and the final steps of testing the old one will set me up to do the replacement without extra work.
If I have to replace the board, I will want to migrate the processor to the new board.
The i7-6700K was purchased from Silicon Lottery with an extra 50 bucks added for their delidding service and prepping the processor with CLU or similar TIM to reinstall the IHS on the processor. I was assured that the materials used would make the IHS just as firmly glued in place as it had been coming out of the factory.
The heatsink is a ThermalRight Le Grand Macho, and I use IC-Diamond paste. I was reticent about using any of the liquid-metal formulations, because they tend to bond the heatsink base to the processor cap. Of course, IC-Diamond spreads on the IHS and heatsink base like wet concrete cement, and after four years, I'm sure that the oil base is pretty dried out. I'm trying to think of clever ways to remove it without doing damage to the processor.
So that's the first question. Has anyone had any bad experiences with Silicon Lottery's re-lidding in this regard?
And second, I came across an article last week that described how Intel's Indium solder itself deteriorates over time, leaving cracks or spaces in the solder so that heat transfer is degraded. Any experience with this after CLU relidding? I hadn't noticed any deterioration in processor cooling, but it wasn't something I was watching very carefully. The Skylake was OC'd to 4.7Ghz, and everything had seemed rock-solid until my accident with the static-charge and the USB controller.
I have one good shot to replace my motherboard with a minimal amount of work, and don't want to run into any disappointments over CPU performance.
If I have to replace the board, I will want to migrate the processor to the new board.
The i7-6700K was purchased from Silicon Lottery with an extra 50 bucks added for their delidding service and prepping the processor with CLU or similar TIM to reinstall the IHS on the processor. I was assured that the materials used would make the IHS just as firmly glued in place as it had been coming out of the factory.
The heatsink is a ThermalRight Le Grand Macho, and I use IC-Diamond paste. I was reticent about using any of the liquid-metal formulations, because they tend to bond the heatsink base to the processor cap. Of course, IC-Diamond spreads on the IHS and heatsink base like wet concrete cement, and after four years, I'm sure that the oil base is pretty dried out. I'm trying to think of clever ways to remove it without doing damage to the processor.
So that's the first question. Has anyone had any bad experiences with Silicon Lottery's re-lidding in this regard?
And second, I came across an article last week that described how Intel's Indium solder itself deteriorates over time, leaving cracks or spaces in the solder so that heat transfer is degraded. Any experience with this after CLU relidding? I hadn't noticed any deterioration in processor cooling, but it wasn't something I was watching very carefully. The Skylake was OC'd to 4.7Ghz, and everything had seemed rock-solid until my accident with the static-charge and the USB controller.
I have one good shot to replace my motherboard with a minimal amount of work, and don't want to run into any disappointments over CPU performance.