FRAM and MRAM are replacements for flash - faster and with the added advantage of not wearing out.
There is a DDR3 specification, which will follow from DDR2. However, except for high-speed graphics cards, it is likely to be a long time before we see it.
The DDR2-DDR3 progression is for a faster memory bus, and it seems likely that this is going to be the primary direction things will go.
Simply making the memory bus wider, or adding more chanels, will simply require greater motherboard PCB complexity, more pins on key chips, and significartly higher prices - The PCBs for high-end graphics cards are already up to 12 layers, and need state-of-the-art manufacturing techniques like laser drilling, and blind or buried holes (vias), and the blank PCB such a card can be several times more expensive than a whole ATX motherboard PCB.
DDR4 or Quad-Pump RAM. Just like intel is using the quad pump on their FSB. Just speculating!
Well, DDR2 is already 'Quad-pumped' internally, although the bus is still DDR (and will stay that way for DDR3).
Conventional DDR is essentially 'double-pumped' RAM - internally there are 2 banks of SDRAM which are accessed alternately. So PC3200 consists of 2 banks of 200 MHz SDRAM (the bus runs at 200 MHz DDR).
DDR2 is arranged internally as 4 banks of SDRAM accessed in a round-robin fashion. DDR2-3200 consists of 4 banks of 100 MHZ SDRAM (the bus runs at 200 MHz DDR - the same as DDR1).
DDR3 is, you guessed it, 8 banks of SDRAM. DDR3-6400 is planned to be 8 banks of 100 MHz SDRAM (with a 400 MHz DDR bus). [It seems likely that when DDR3 actually launches, it will do so at a faster speed than this].